JPH02115478U

JPH02115478U -

Info

Publication number: JPH02115478U
Application number: JP2316189U
Authority: JP
Priority date: 1989-03-01
Filing date: 1989-03-01
Publication date: 1990-09-14

Description

[Brief explanation of drawings]

第１図ａ，ｂは各々本考案の一実施例によるＩ
Ｃカードを示す斜視図及び断面図、第２図ａ，ｂ
は各々本考案の一実施例によるＩＣカードで用い
られる半導体装置を示す斜視図及び側面図、第３
図ａ，ｂは各々本考案の他の実施例によるＩＣカ
ードを示す断面図及びこのＩＣカードに用いる半
導体装置を示す側面図、第４図は本考案の他の実
施例によるＩＣカードを示す断面図、第５図ａ，
ｂは各々本考案の他の実施例による上記ＩＣカー
ドに用いる半導体装置を示す斜視図及び断面図、
第６図ａ，ｂは各々従来のＩＣカードを示す斜視
図及び第６図ａのｘ−ｙ線での断面図、並びに第
７図は従来のＩＣカードで用いられる半導体装置
の一例を示す斜視図である。図において、１，１０はリード、２は封止樹脂
、３は半導体素子、５は基体である。なお、図中
、同一符号は同一または相当部分を示す。 Figures 1a and 1b are each an I according to an embodiment of the present invention.
Perspective view and cross-sectional view showing the C card, Figures 2a and b
3 is a perspective view and a side view showing a semiconductor device used in an IC card according to an embodiment of the present invention, respectively.
Figures a and b are a cross-sectional view showing an IC card according to another embodiment of the present invention and a side view showing a semiconductor device used in this IC card, respectively, and Fig. 4 is a cross-sectional view showing an IC card according to another embodiment of the present invention. Figure 5a,
b is a perspective view and a sectional view respectively showing a semiconductor device used in the above IC card according to another embodiment of the present invention;
6a and 6b are respectively a perspective view showing a conventional IC card and a sectional view taken along the x-y line of FIG. 6a, and FIG. 7 is a perspective view showing an example of a semiconductor device used in a conventional IC card. It is a diagram. In the figure, 1 and 10 are leads, 2 is a sealing resin, 3 is a semiconductor element, and 5 is a base body. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims

[Scope of Claim for Utility Model Registration] (1) In an IC card in which a semiconductor device whose periphery is molded with a molding material is mounted in a base body, one side of the lead itself of the semiconductor element taken out from the molding material is An IC card characterized in that the IC card is exposed on the surface of the base, and the other side is fixed to the base. (2) In an IC card in which a semiconductor device whose periphery is molded with a molding material is mounted in a base, one side of the lead of the semiconductor element taken out from the molding material is on the surface of the base. An IC card characterized in that the IC card has a structure in which the other side is exposed to the mold material and the other side is fixed to the mold material.