JPH0356146U - - Google Patents
Info
- Publication number
- JPH0356146U JPH0356146U JP11602289U JP11602289U JPH0356146U JP H0356146 U JPH0356146 U JP H0356146U JP 11602289 U JP11602289 U JP 11602289U JP 11602289 U JP11602289 U JP 11602289U JP H0356146 U JPH0356146 U JP H0356146U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring pattern
- semiconductor device
- semiconductor element
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例を示す半
導体装置の構造図であり、同図ａは平面図、同図
ｂは同図ａのＡ−Ａ線断面図、第２図は従来の半
導体装置の断面図、第３図は応力印加時における
第２図の半導体装置の断面図、第４図ａ，ｂは本
考案の第２の実施例を示す半導体装置の構造図で
あり、同図ａは平面図、同図ｂは同図ａのＢ−Ｂ
線断面図、第５図ａ，ｂは本考案の第３の実施例
を示す半導体装置の構造図であり、同図ａは平面
図、同図ｂは同図ａのＣ−Ｃ線断面図である。
１１……回路基板、１２……配線パターン、１
２ａ……素子搭載部、１２ｂ……リード部、１３
……半導体素子、１４……ワイヤ、１５，１５ａ
，１５ｂ……突起部、１６……封止樹脂部。
1A and 1B are structural diagrams of a semiconductor device showing a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. is a sectional view of a conventional semiconductor device, FIG. 3 is a sectional view of the semiconductor device of FIG. 2 when stress is applied, and FIGS. 4a and 4b are structural diagrams of a semiconductor device showing a second embodiment of the present invention. Yes, figure a is a plan view, figure b is B-B of figure a.
5A and 5B are structural diagrams of a semiconductor device showing a third embodiment of the present invention, FIG. 5A is a plan view, and FIG. It is. 11... Circuit board, 12... Wiring pattern, 1
2a...Element mounting part, 12b...Lead part, 13
... Semiconductor element, 14 ... Wire, 15, 15a
, 15b... protrusion, 16... sealing resin part.
Claims (1)
接続された半導体素子と、 前記半導体素子及び配線パターンを封止する封
止樹脂部とを、 備えた半導体装置において、 前記半導体素子の周囲に位置し前記封止樹脂部
内に埋設される環状あるいは非環状の突起部を、
前記回路基板上に突設したことを特徴とする半導
体装置。[Claims for Utility Model Registration] A circuit board with a wiring pattern formed on its surface, a semiconductor element fixed on the circuit board and connected to the wiring pattern, and a seal for sealing the semiconductor element and the wiring pattern. A semiconductor device comprising: a resin portion;
A semiconductor device, characterized in that it is provided protrudingly on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11602289U JPH0356146U (en) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11602289U JPH0356146U (en) | 1989-10-02 | 1989-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356146U true JPH0356146U (en) | 1991-05-30 |
Family
ID=31664329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11602289U Pending JPH0356146U (en) | 1989-10-02 | 1989-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356146U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009183369A (en) * | 2008-02-04 | 2009-08-20 | Kazuma:Kk | Multiple curtain |
| JP2010067850A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Circuit device |
-
1989
- 1989-10-02 JP JP11602289U patent/JPH0356146U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009183369A (en) * | 2008-02-04 | 2009-08-20 | Kazuma:Kk | Multiple curtain |
| JP4551458B2 (en) * | 2008-02-04 | 2010-09-29 | 株式会社カズマ | Multiple curtains |
| JP2010067850A (en) * | 2008-09-11 | 2010-03-25 | Sanyo Electric Co Ltd | Circuit device |