JPS6172857U - - Google Patents
Info
- Publication number
- JPS6172857U JPS6172857U JP15750984U JP15750984U JPS6172857U JP S6172857 U JPS6172857 U JP S6172857U JP 15750984 U JP15750984 U JP 15750984U JP 15750984 U JP15750984 U JP 15750984U JP S6172857 U JPS6172857 U JP S6172857U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- protrusion
- resin
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は本考案の一実施例を示す第１図の断面透視図
である。第３図は従来例を示す断面透視図である
。
１……封止樹脂、２……リード部、３……半導
体素子搭載部、４……半導体素子、５……ボンデ
イング線、６……突起部。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional perspective view of FIG. 1 showing an embodiment of the present invention. FIG. 3 is a cross-sectional perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Sealing resin, 2...Lead part, 3...Semiconductor element mounting part, 4...Semiconductor element, 5...Bonding wire, 6...Protrusion part.
Claims (1)
体素子を搭載する部位以外に突起を設けたことを
特徴とする樹脂封止型半導体装置。 A resin-sealed semiconductor device characterized in that a protrusion is provided in a portion of a substrate forming a mounting portion for a semiconductor element other than a portion on which a semiconductor element is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15750984U JPS6172857U (en) | 1984-10-18 | 1984-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15750984U JPS6172857U (en) | 1984-10-18 | 1984-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172857U true JPS6172857U (en) | 1986-05-17 |
Family
ID=30715501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15750984U Pending JPS6172857U (en) | 1984-10-18 | 1984-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172857U (en) |
-
1984
- 1984-10-18 JP JP15750984U patent/JPS6172857U/ja active Pending