JPH02132954U - - Google Patents
Info
- Publication number
- JPH02132954U JPH02132954U JP4341189U JP4341189U JPH02132954U JP H02132954 U JPH02132954 U JP H02132954U JP 4341189 U JP4341189 U JP 4341189U JP 4341189 U JP4341189 U JP 4341189U JP H02132954 U JPH02132954 U JP H02132954U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- bonding wire
- semiconductor device
- internal lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａは本考案の第１の実施例の平面図、第
１図ｂは第１図ａのＡ部の拡大断面図、第２図ａ
は第２の実施例の平面図、第２図ｂは第１図ａの
Ａ部の拡大断面図、第３図ａは従来例の平面図、
第３図ｂは第３図ａのＡ部の拡大断面図である。
１……半導体素子、２……タブ、３……タブ吊
りリード、４……内部リード、５……ボンデイン
グワイヤ、６……封止樹脂、７……外部リード、
８ａ……ゲル状樹脂層、８ｂ……半流動状樹脂層
、９……ボンデイング部クラツク。
Figure 1a is a plan view of the first embodiment of the present invention, Figure 1b is an enlarged sectional view of section A in Figure 1a, Figure 2a is
is a plan view of the second embodiment, FIG. 2b is an enlarged sectional view of section A in FIG. 1a, and FIG. 3a is a plan view of the conventional example.
FIG. 3b is an enlarged sectional view of section A in FIG. 3a. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Tab, 3... Tab suspension lead, 4... Internal lead, 5... Bonding wire, 6... Sealing resin, 7... External lead,
8a... Gel-like resin layer, 8b... Semi-fluid resin layer, 9... Bonding part crack.
Claims (1)
ンデイングワイヤで結線して封止した樹脂封止型
半導体装置において、前記内部リードとボンデイ
ングワイヤの結線部を覆うゲル状又は半流動性樹
脂層が設けられていることを特徴とする樹脂封止
型半導体装置。 In a resin-sealed semiconductor device in which a semiconductor element mounted on a tab and an internal lead are connected and sealed with a bonding wire, a gel-like or semi-fluid resin layer is provided to cover a connection portion between the internal lead and the bonding wire. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4341189U JPH02132954U (en) | 1989-04-12 | 1989-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4341189U JPH02132954U (en) | 1989-04-12 | 1989-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132954U true JPH02132954U (en) | 1990-11-05 |
Family
ID=31555803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4341189U Pending JPH02132954U (en) | 1989-04-12 | 1989-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132954U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019146796A1 (en) * | 2018-01-29 | 2019-08-01 | 京セラ株式会社 | Sample holder |
-
1989
- 1989-04-12 JP JP4341189U patent/JPH02132954U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019146796A1 (en) * | 2018-01-29 | 2019-08-01 | 京セラ株式会社 | Sample holder |
| KR20200095557A (en) * | 2018-01-29 | 2020-08-10 | 교세라 가부시키가이샤 | Sample holder |
| JPWO2019146796A1 (en) * | 2018-01-29 | 2021-01-28 | 京セラ株式会社 | Sample holder |
| US11640920B2 (en) | 2018-01-29 | 2023-05-02 | Kyocera Corporation | Sample holder |