JPH01146543U - - Google Patents
Info
- Publication number
- JPH01146543U JPH01146543U JP4206888U JP4206888U JPH01146543U JP H01146543 U JPH01146543 U JP H01146543U JP 4206888 U JP4206888 U JP 4206888U JP 4206888 U JP4206888 U JP 4206888U JP H01146543 U JPH01146543 U JP H01146543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- light
- photosensitive area
- sealing body
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Non-Volatile Memory (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案の実施例に係る半導体素子の実
装体構造を示す断面図、第２図ａ，ｂ，ｃ，ｄは
この実装体を製造する製造工程の一例を示す図、
第３図は従来の実装体構造の一例を示す断面図で
ある。
１，１１…半導体素子、２，１２…感光部、１
６…封止体、１７…開孔部、１８…透光体。
FIG. 1 is a cross-sectional view showing the structure of a semiconductor element package according to an embodiment of the present invention, and FIGS. 2 a, b, c, and d are views showing an example of the manufacturing process for manufacturing this package.
FIG. 3 is a sectional view showing an example of a conventional mounting structure. 1, 11... Semiconductor element, 2, 12... Photosensitive section, 1
6... Sealing body, 17... Opening part, 18... Transparent body.
Claims (1)
て、半導体素子を樹脂製の封止体で被包するとと
もに、この封止体に感光部に連通する開孔部を開
設し、この開孔部に透光性樹脂で形成される透光
体を装填したことを特徴とする半導体素子の実装
体構造。 In a structure for mounting a semiconductor element having a photosensitive area, the semiconductor element is encapsulated in a resin sealing body, and an opening communicating with the photosensitive area is provided in the sealing body. A semiconductor element mounting structure characterized by being loaded with a light-transmitting body made of a light-transmitting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206888U JPH01146543U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206888U JPH01146543U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146543U true JPH01146543U (en) | 1989-10-09 |
Family
ID=31268493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4206888U Pending JPH01146543U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146543U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243540A (en) * | 1992-02-27 | 1993-09-21 | Sanyo Electric Co Ltd | Solid-state image sensing element and its manufacture |
| KR101032061B1 (en) * | 2008-10-16 | 2011-05-02 | 르네사스 일렉트로닉스 가부시키가이샤 | Electronic device and process for manufacturing electronic device |
-
1988
- 1988-03-31 JP JP4206888U patent/JPH01146543U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243540A (en) * | 1992-02-27 | 1993-09-21 | Sanyo Electric Co Ltd | Solid-state image sensing element and its manufacture |
| KR101032061B1 (en) * | 2008-10-16 | 2011-05-02 | 르네사스 일렉트로닉스 가부시키가이샤 | Electronic device and process for manufacturing electronic device |