JPH0485737U - - Google Patents
Info
- Publication number
- JPH0485737U JPH0485737U JP12888990U JP12888990U JPH0485737U JP H0485737 U JPH0485737 U JP H0485737U JP 12888990 U JP12888990 U JP 12888990U JP 12888990 U JP12888990 U JP 12888990U JP H0485737 U JPH0485737 U JP H0485737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- plan
- view
- molded resin
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例である半導体装置
の平面図、第２図は第１図の半導体装置の位置決
め状態を示す平面図、第３図は従来の半導体装置
の平面図、第４図は従来およびこの考案共通のモ
ールド樹脂封止されたリードフレームとランナー
部を示す平面図、第５図は従来の半導体装置の位
置決め状態を示す平面図である。
図において、１はモールド樹脂、２はアウター
リード、３はゲート残り、７は位置決め治具、８
は半田付マウントを示す。なお、図中、同一符号
は同一、または相当部分を示す。
FIG. 1 is a plan view of a semiconductor device which is an embodiment of this invention, FIG. 2 is a plan view showing the positioning state of the semiconductor device of FIG. 1, FIG. 3 is a plan view of a conventional semiconductor device, and FIG. This figure is a plan view showing a lead frame and a runner portion sealed with a molded resin, which is common to the conventional device and this invention, and FIG. 5 is a plan view showing the positioning state of the conventional semiconductor device. In the figure, 1 is the mold resin, 2 is the outer lead, 3 is the remaining gate, 7 is the positioning jig, and 8
indicates a soldered mount. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ツケージのゲート部を凹形状にしたことを特徴と
する半導体装置。 1. A semiconductor device, wherein a gate portion of a molded resin package of the semiconductor device is formed into a concave shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12888990U JPH0485737U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12888990U JPH0485737U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485737U true JPH0485737U (en) | 1992-07-24 |
Family
ID=31876327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12888990U Pending JPH0485737U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023276006A1 (en) * | 2021-06-29 | 2023-01-05 | オリンパスメディカルシステムズ株式会社 | Imaging unit, endoscope, and imaging unit manufacturing method |
-
1990
- 1990-11-29 JP JP12888990U patent/JPH0485737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023276006A1 (en) * | 2021-06-29 | 2023-01-05 | オリンパスメディカルシステムズ株式会社 | Imaging unit, endoscope, and imaging unit manufacturing method |