JPH01107150U - - Google Patents
Info
- Publication number
- JPH01107150U JPH01107150U JP70288U JP70288U JPH01107150U JP H01107150 U JPH01107150 U JP H01107150U JP 70288 U JP70288 U JP 70288U JP 70288 U JP70288 U JP 70288U JP H01107150 U JPH01107150 U JP H01107150U
- Authority
- JP
- Japan
- Prior art keywords
- molded resin
- lead frame
- sealed package
- sealed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を使用した、モール
ド樹脂封止パツケージの断面図、第２図は、内部
リードとモールド樹脂との界面にすき間が生じた
場合の断面図、第３図は本考案の実施例２の外観
図である。第４図、第５図は実施例３を示す図で
ある。
１……外部リード、２……内部リード、３……
凹部、４……ボンデイングワイヤ、５……集積回
路チツプ、６……リードフレームマウント部、７
……モールド樹脂、８……すき間、９……凹残部
。
Fig. 1 is a sectional view of a molded resin sealed package using an embodiment of the present invention, Fig. 2 is a sectional view when a gap is created at the interface between the internal lead and the molded resin, and Fig. 3 is a sectional view of a package sealed with molded resin using an embodiment of the present invention. It is an external view of Example 2 of this invention. FIG. 4 and FIG. 5 are diagrams showing the third embodiment. 1...External lead, 2...Internal lead, 3...
Recessed portion, 4...Bonding wire, 5...Integrated circuit chip, 6...Lead frame mounting portion, 7
...Mold resin, 8...Gap, 9...Concave remainder.
Claims (1)
ジに使用するリードフレームにおいて、モールド
樹脂封止後にモールド樹脂内部となる内部リード
部の一部に凹部を有することを特徴とするモール
ド樹脂封止パツケージ用リードフレーム。 A lead frame for use in a molded resin sealed package on which an integrated circuit is mounted, the lead frame for a molded resin sealed package having a recessed part in a part of the internal lead part that becomes inside the molded resin after being sealed with the molded resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP70288U JPH01107150U (en) | 1988-01-06 | 1988-01-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP70288U JPH01107150U (en) | 1988-01-06 | 1988-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107150U true JPH01107150U (en) | 1989-07-19 |
Family
ID=31199961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP70288U Pending JPH01107150U (en) | 1988-01-06 | 1988-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107150U (en) |
-
1988
- 1988-01-06 JP JP70288U patent/JPH01107150U/ja active Pending
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