JPH0317642U - - Google Patents

Info

Publication number
JPH0317642U
JPH0317642U JP7846589U JP7846589U JPH0317642U JP H0317642 U JPH0317642 U JP H0317642U JP 7846589 U JP7846589 U JP 7846589U JP 7846589 U JP7846589 U JP 7846589U JP H0317642 U JPH0317642 U JP H0317642U
Authority
JP
Japan
Prior art keywords
lead
view
plan
resin
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7846589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7846589U priority Critical patent/JPH0317642U/ja
Publication of JPH0317642U publication Critical patent/JPH0317642U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の平面図、第2図は
本考案におけるリードの平面図、第3図は本考案
におけるタブリードのリング部付近の断面図、第
4図は従来のリードフレームの一例の平面図、第
5図は樹脂モールド後リードを折曲加工した状態
を示す断面図である。 10…リードフレーム、11…タブ、13,1
…リード、132a…曲部、15…枠、17
…樹脂。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a plan view of the lead in the present invention, Fig. 3 is a sectional view of the vicinity of the ring portion of the tab lead in the present invention, and Fig. 4 is a conventional lead frame. FIG. 5 is a plan view of an example, and FIG. 5 is a sectional view showing a state in which the leads are bent after resin molding. 10...Lead frame, 11...Tab, 13,1
3 2 ... Lead, 13 2a ... Curved part, 15... Frame, 17
…resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボンデイングワイヤ接続用のリードのうち、樹
脂でモールドされる部分に平面図上略V字状の曲
部を複数設けられてなるICチツプ用リードフレ
ーム。
A lead frame for an IC chip, in which a plurality of approximately V-shaped curved portions in a plan view are provided on the portion of the lead for bonding wire connection that is molded with resin.
JP7846589U 1989-07-03 1989-07-03 Pending JPH0317642U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7846589U JPH0317642U (en) 1989-07-03 1989-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7846589U JPH0317642U (en) 1989-07-03 1989-07-03

Publications (1)

Publication Number Publication Date
JPH0317642U true JPH0317642U (en) 1991-02-21

Family

ID=31621762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7846589U Pending JPH0317642U (en) 1989-07-03 1989-07-03

Country Status (1)

Country Link
JP (1) JPH0317642U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7684678B2 (en) 2003-03-31 2010-03-23 Funai Electric Co., Ltd. Disc reproducing apparatus having screen display control unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7684678B2 (en) 2003-03-31 2010-03-23 Funai Electric Co., Ltd. Disc reproducing apparatus having screen display control unit

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