JPH01176937U - - Google Patents
Info
- Publication number
- JPH01176937U JPH01176937U JP7401288U JP7401288U JPH01176937U JP H01176937 U JPH01176937 U JP H01176937U JP 7401288 U JP7401288 U JP 7401288U JP 7401288 U JP7401288 U JP 7401288U JP H01176937 U JPH01176937 U JP H01176937U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- resins
- boundary
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例であるところのフ
ラツトパツケージ型集積回路半導体装置の側面図
である。
１，１′……外部引き出しリード、２，２′…
…外部引き出しリードの引き出し部、３……黒の
色調の樹脂、４……白の色調の樹脂。
FIG. 1 is a side view of a flat package integrated circuit semiconductor device which is an embodiment of the present invention. 1, 1'...External pull-out lead, 2, 2'...
...Drawer part of external drawer lead, 3...Black-toned resin, 4...White-toned resin.
Claims (1)
引き出し部を境界にして、一方と他方が互いに異
なる色調の樹脂で構成されていることを特徴とす
る樹脂封止型の半導体装置。 1. A resin-sealed semiconductor device characterized in that one side and the other side are made of resins of different colors, with the extraction part of the external lead as a boundary in the thickness direction of the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7401288U JPH01176937U (en) | 1988-06-02 | 1988-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7401288U JPH01176937U (en) | 1988-06-02 | 1988-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176937U true JPH01176937U (en) | 1989-12-18 |
Family
ID=31299130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7401288U Pending JPH01176937U (en) | 1988-06-02 | 1988-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176937U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001716A1 (en) * | 2000-06-26 | 2002-01-03 | Kabushiki Kaisha Toshiba | Saw device |
-
1988
- 1988-06-02 JP JP7401288U patent/JPH01176937U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001716A1 (en) * | 2000-06-26 | 2002-01-03 | Kabushiki Kaisha Toshiba | Saw device |
| US6897742B2 (en) | 2000-06-26 | 2005-05-24 | Kabushiki Kaisha Toshiba | Saw device using different colors or identifiers to distinguish the front and back of the package |