JPH0440542U - - Google Patents
Info
- Publication number
- JPH0440542U JPH0440542U JP8118290U JP8118290U JPH0440542U JP H0440542 U JPH0440542 U JP H0440542U JP 8118290 U JP8118290 U JP 8118290U JP 8118290 U JP8118290 U JP 8118290U JP H0440542 U JPH0440542 U JP H0440542U
- Authority
- JP
- Japan
- Prior art keywords
- lead parts
- connects
- lead
- guide part
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図〜第３図は、本考案に係るＩＣチツプ用
リードフレームの実施例を示す図で、第１図はＩ
Ｃ用リードフレームの図、第２図は第１図のリー
ドフレームにＩＣチツプを装着後の状態の図、第
３図は半導体素子の図、第４図、第５図は従来の
ＩＣ用リードフレームを示す図で、第４図はＩＣ
用リードフレームの図、第５図は第４図のリード
フレームにＩＣチツプを装着後の状態の図である
。
１，２，３，１１，１２，１３……リード部、
４，１４……ガイド部、２０……切欠き。
1 to 3 are views showing an embodiment of the lead frame for an IC chip according to the present invention, and FIG.
Figure 2 is a diagram of the IC chip mounted on the lead frame of Figure 1, Figure 3 is a diagram of a semiconductor element, Figures 4 and 5 are conventional IC leads. This is a diagram showing the frame, and Figure 4 is an IC
FIG. 5 is a view of the lead frame of FIG. 4 after an IC chip is mounted on the lead frame. 1, 2, 3, 11, 12, 13... lead part,
4, 14... Guide portion, 20... Notch.
Claims (1)
案内するガイド部とを備え、該ガイド部の該リー
ド部と連結する部分に切欠きを形成してなる構成
のＩＣ用リードフレーム。 A lead frame for an IC comprising a plurality of lead parts and a guide part that connects and guides the lead parts, and has a notch formed in a part of the guide part that connects with the lead parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8118290U JPH0440542U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8118290U JPH0440542U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440542U true JPH0440542U (en) | 1992-04-07 |
Family
ID=31626893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8118290U Pending JPH0440542U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440542U (en) |
-
1990
- 1990-07-31 JP JP8118290U patent/JPH0440542U/ja active Pending