JPH0254243U - - Google Patents
Info
- Publication number
- JPH0254243U JPH0254243U JP13382188U JP13382188U JPH0254243U JP H0254243 U JPH0254243 U JP H0254243U JP 13382188 U JP13382188 U JP 13382188U JP 13382188 U JP13382188 U JP 13382188U JP H0254243 U JPH0254243 U JP H0254243U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- tip
- semiconductor device
- groove
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
第１図Ａ，Ｂはそれぞれ本考案による第１の実
施例を示す平面図及び側面図、第２図は本考案に
よる第２の実施例を示す側面図、第３図Ａは従来
の半導体装置の放熱板先端部分の側面図、第３図
Ｂは第３図Ａの１５の部分にバリの発生を付加し
た構造の側面図である。
１１……半導体装置の放熱板、１２……放熱板
先端部分の溝部の段差、１３……放熱板先端部分
のテーパ、１４……放熱板先端部分のバリ、１５
……放熱板裏面の先端部分。
1A and 1B are a plan view and a side view showing a first embodiment of the present invention, respectively, FIG. 2 is a side view of a second embodiment of the present invention, and FIG. 3A is a conventional semiconductor device. FIG. 3B is a side view of a structure in which burrs are added to the portion 15 in FIG. 3A. 11... Heat sink of semiconductor device, 12... Step in groove at tip of heat sink, 13... Taper at tip of heat sink, 14... Burr at tip of heat sink, 15
...The tip of the back of the heat sink.
Claims (1)
たことを特徴とする半導体装置のリードフレーム
。 A lead frame for a semiconductor device, characterized in that a groove is provided at the tip of a heat sink to form a step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13382188U JPH0254243U (en) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13382188U JPH0254243U (en) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254243U true JPH0254243U (en) | 1990-04-19 |
Family
ID=31392041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13382188U Pending JPH0254243U (en) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254243U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088365A (en) * | 2005-09-26 | 2007-04-05 | Sanyo Electric Co Ltd | Circuit device |
-
1988
- 1988-10-12 JP JP13382188U patent/JPH0254243U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088365A (en) * | 2005-09-26 | 2007-04-05 | Sanyo Electric Co Ltd | Circuit device |
| JP4711792B2 (en) * | 2005-09-26 | 2011-06-29 | 三洋電機株式会社 | Circuit equipment |