JPH0226260U - - Google Patents
Info
- Publication number
- JPH0226260U JPH0226260U JP10481388U JP10481388U JPH0226260U JP H0226260 U JPH0226260 U JP H0226260U JP 10481388 U JP10481388 U JP 10481388U JP 10481388 U JP10481388 U JP 10481388U JP H0226260 U JPH0226260 U JP H0226260U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- width dimension
- suspension lead
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000725 suspension Substances 0.000 claims 3
- 239000007767 bonding agent Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す平面図、第
２図は従来装置の平面図、第３図は同様に従来装
置の平面図、第４図はその部分断面図である。
図中、２はダイパツト、４０は溝である。なお
、各図中同一符号は同一又は相当部分を示す。
FIG. 1 is a plan view showing an embodiment of this invention, FIG. 2 is a plan view of a conventional device, FIG. 3 is a plan view of the conventional device, and FIG. 4 is a partial sectional view thereof. In the figure, 2 is a die pad and 40 is a groove. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
体リードフレームにおいて、ダイパツト上面には
、つりリードに近接して、上記つりリードの長手
方向に直交する方向で、且つ上記つりリードの幅
寸法と同等以上の幅寸法の範囲に溝を形成したこ
とを特徴とする半導体リードフレーム。 In a semiconductor lead frame in which a semiconductor chip is bonded with a bonding agent, on the top surface of the die part, a width dimension is provided close to the suspension lead in a direction perpendicular to the longitudinal direction of the suspension lead, and which is equal to or greater than the width dimension of the suspension lead. A semiconductor lead frame characterized in that a groove is formed in the range of .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10481388U JPH0226260U (en) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10481388U JPH0226260U (en) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226260U true JPH0226260U (en) | 1990-02-21 |
Family
ID=31336863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10481388U Pending JPH0226260U (en) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226260U (en) |
-
1988
- 1988-08-08 JP JP10481388U patent/JPH0226260U/ja active Pending