JPH02138453U - - Google Patents
Info
- Publication number
- JPH02138453U JPH02138453U JP4702989U JP4702989U JPH02138453U JP H02138453 U JPH02138453 U JP H02138453U JP 4702989 U JP4702989 U JP 4702989U JP 4702989 U JP4702989 U JP 4702989U JP H02138453 U JPH02138453 U JP H02138453U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- heat sink
- semiconductor laser
- recess
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Description
第１図は本考案の第１の実施例の図である。第
２図は、本考案の第２の実施例の図である。第３
図は、従来の半導体レーザ装置の図である。
１……押え部材、２……ボンデイング線、３…
…半導体レーザ素子、４……ヒートシンク、５…
…ステム。
FIG. 1 is a diagram of a first embodiment of the present invention. FIG. 2 is a diagram of a second embodiment of the present invention. Third
The figure is a diagram of a conventional semiconductor laser device. 1... Pressing member, 2... Bonding wire, 3...
...Semiconductor laser element, 4...Heat sink, 5...
...Stem.
Claims (1)
ントしたヒートシンクを前記ステムの窪みの中に
設置し、当該ヒートシンク上面を押え部材で押え
て前記ヒートシンクをステムに固定したことを特
徴とする半導体レーザ装置。 A semiconductor laser device, characterized in that a recess is provided in the stem, a heat sink having a semiconductor laser element mounted thereon is installed in the recess of the stem, and the heat sink is fixed to the stem by pressing the upper surface of the heat sink with a pressing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4702989U JPH02138453U (en) | 1989-04-21 | 1989-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4702989U JPH02138453U (en) | 1989-04-21 | 1989-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138453U true JPH02138453U (en) | 1990-11-19 |
Family
ID=31562606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4702989U Pending JPH02138453U (en) | 1989-04-21 | 1989-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138453U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048839A (en) * | 2005-08-08 | 2007-02-22 | Mitsubishi Electric Corp | Semiconductor element |
-
1989
- 1989-04-21 JP JP4702989U patent/JPH02138453U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048839A (en) * | 2005-08-08 | 2007-02-22 | Mitsubishi Electric Corp | Semiconductor element |