JPS6185175U - - Google Patents
Info
- Publication number
- JPS6185175U JPS6185175U JP16962184U JP16962184U JPS6185175U JP S6185175 U JPS6185175 U JP S6185175U JP 16962184 U JP16962184 U JP 16962184U JP 16962184 U JP16962184 U JP 16962184U JP S6185175 U JPS6185175 U JP S6185175U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- heat sink
- recess
- stem
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Description
第１図乃至第３図は本考案半導体レーザ装置の
実施の一例を示すもので、第１図は全体の分解斜
視図、第２図は半導体レーザが接続されたヒート
シンクを得る方法の一例を示す斜視図、第３図は
ステムを示す断面図、第４図は本考案半導体レー
ザ装置におけるヒートシンク位置決め凹部の変形
例を示すステムの断面図、第５図は半導体レーザ
が接続されたヒートシンクを得る方法の別の例を
示す斜視図、第６図は半導体レーザの一つの従来
例を示す分解斜視図である。
符号の説明、１…ステム、２，２ａ…ヒートシ
ンク位置決め凹部、３，３ａ…ヒートシンク、７
…半導体レーザ。
1 to 3 show an example of the implementation of the semiconductor laser device of the present invention, FIG. 1 is an exploded perspective view of the entire device, and FIG. 2 shows an example of a method for obtaining a heat sink to which a semiconductor laser is connected. A perspective view, FIG. 3 is a sectional view showing the stem, FIG. 4 is a sectional view of the stem showing a modification of the heat sink positioning recess in the semiconductor laser device of the present invention, and FIG. 5 is a method for obtaining a heat sink to which a semiconductor laser is connected. FIG. 6 is an exploded perspective view showing one conventional example of a semiconductor laser. Explanation of symbols, 1... Stem, 2, 2a... Heat sink positioning recess, 3, 3a... Heat sink, 7
...semiconductor laser.
Claims (1)
され、該凹部上に半導体レーザがボンデイングさ
れたヒートシンクが固定されてなることを特徴と
する半導体レーザ装置。 A semiconductor laser device characterized in that a heat sink positioning recess is formed on the surface of the stem, and a heat sink to which a semiconductor laser is bonded is fixed onto the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16962184U JPS6185175U (en) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16962184U JPS6185175U (en) | 1984-11-08 | 1984-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185175U true JPS6185175U (en) | 1986-06-04 |
Family
ID=30727343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16962184U Pending JPS6185175U (en) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004146777A (en) * | 2002-08-26 | 2004-05-20 | Sumitomo Electric Ind Ltd | Semiconductor laser module and semiconductor laser |
-
1984
- 1984-11-08 JP JP16962184U patent/JPS6185175U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004146777A (en) * | 2002-08-26 | 2004-05-20 | Sumitomo Electric Ind Ltd | Semiconductor laser module and semiconductor laser |
| JP4586337B2 (en) * | 2002-08-26 | 2010-11-24 | 住友電気工業株式会社 | Semiconductor laser module and semiconductor laser device |