JPH0256440U - - Google Patents

Info

Publication number
JPH0256440U
JPH0256440U JP13571588U JP13571588U JPH0256440U JP H0256440 U JPH0256440 U JP H0256440U JP 13571588 U JP13571588 U JP 13571588U JP 13571588 U JP13571588 U JP 13571588U JP H0256440 U JPH0256440 U JP H0256440U
Authority
JP
Japan
Prior art keywords
groove
utility
scope
back surface
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13571588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13571588U priority Critical patent/JPH0256440U/ja
Publication of JPH0256440U publication Critical patent/JPH0256440U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10158Shape being other than a cuboid at the passive surface

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1の実施例の平面図、第2
図は第1図の部分拡大図、第3図は本考案の第2
の実施例の平面図である。 1……ウエハー、2……溝、3……荒らし部。
Figure 1 is a plan view of the first embodiment of the present invention;
The figure is a partially enlarged view of Fig. 1, and Fig. 3 is the second part of the present invention.
FIG. 1... Wafer, 2... Groove, 3... Rough part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子の裏面に溝を有することを特徴とす
る半導体装置。
A semiconductor device characterized by having a groove on the back surface of a semiconductor element.
JP13571588U 1988-10-17 1988-10-17 Pending JPH0256440U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13571588U JPH0256440U (en) 1988-10-17 1988-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13571588U JPH0256440U (en) 1988-10-17 1988-10-17

Publications (1)

Publication Number Publication Date
JPH0256440U true JPH0256440U (en) 1990-04-24

Family

ID=31395591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13571588U Pending JPH0256440U (en) 1988-10-17 1988-10-17

Country Status (1)

Country Link
JP (1) JPH0256440U (en)

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