JPH0258344U - - Google Patents
Info
- Publication number
- JPH0258344U JPH0258344U JP13803588U JP13803588U JPH0258344U JP H0258344 U JPH0258344 U JP H0258344U JP 13803588 U JP13803588 U JP 13803588U JP 13803588 U JP13803588 U JP 13803588U JP H0258344 U JPH0258344 U JP H0258344U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- notch
- lead
- substrate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案による半導体パツケージを示
す斜視図、第２図はこの考案の他の実施例を示す
半導体パツケージの斜視図、第３図は従来の半導
体パツケージを示す斜視図である。
図において、１はパツケージ本体、２は蓋、３
はリード、３ａは切欠部、３ｂは長穴部を示す。
なお、図中、同一符号は同一、又は相当部分を示
す。
FIG. 1 is a perspective view showing a semiconductor package according to this invention, FIG. 2 is a perspective view of a semiconductor package showing another embodiment of this invention, and FIG. 3 is a perspective view showing a conventional semiconductor package. In the figure, 1 is the package body, 2 is the lid, and 3
3a is a notch, and 3b is a long hole.
In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を設けられたリードを備えたことを特徴とする半
導体パツケージ。 A semiconductor package mounted on a substrate, characterized in that the semiconductor package is equipped with a lead having a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13803588U JPH0258344U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13803588U JPH0258344U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258344U true JPH0258344U (en) | 1990-04-26 |
Family
ID=31400004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13803588U Pending JPH0258344U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258344U (en) |
-
1988
- 1988-10-21 JP JP13803588U patent/JPH0258344U/ja active Pending