JPH0323945U - - Google Patents
Info
- Publication number
- JPH0323945U JPH0323945U JP8488889U JP8488889U JPH0323945U JP H0323945 U JPH0323945 U JP H0323945U JP 8488889 U JP8488889 U JP 8488889U JP 8488889 U JP8488889 U JP 8488889U JP H0323945 U JPH0323945 U JP H0323945U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- semiconductor device
- substrate
- lead portion
- horizontal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の実施例による半導体装置の概
略構成図、第2図は従来の半導体装置の概略構成
図、第3図は第1図のリード部の形状の例を示す
概略図である。
主要部分の符号の説明、1……キヤツプ、2…
…パツケージ、3……リード部、4……半導体集
積回路。
FIG. 1 is a schematic diagram of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a schematic diagram of a conventional semiconductor device, and FIG. 3 is a schematic diagram showing an example of the shape of the lead portion of FIG. 1. . Explanation of the symbols of the main parts, 1... Cap, 2...
...Package, 3...Lead part, 4...Semiconductor integrated circuit.
Claims (1)
板に接続されるリード部とを含む半導体装置であ
つて、前記リード部の前記本体側の端部において
前記基板の表面に対して略垂直方向の弾性を水平
方向のそれよりも大なる形状としたことを特徴と
する半導体装置。 A semiconductor device including a main body and a lead portion having one end connected to the main body and the other end connected to a substrate, wherein an end of the lead portion on the main body side is substantially perpendicular to the surface of the substrate. A semiconductor device characterized in that the shape has greater elasticity in the horizontal direction than in the horizontal direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8488889U JPH0323945U (en) | 1989-07-19 | 1989-07-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8488889U JPH0323945U (en) | 1989-07-19 | 1989-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0323945U true JPH0323945U (en) | 1991-03-12 |
Family
ID=31633669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8488889U Pending JPH0323945U (en) | 1989-07-19 | 1989-07-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0323945U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104009010A (en) * | 2013-02-27 | 2014-08-27 | 株式会社电装 | Semiconductor device |
-
1989
- 1989-07-19 JP JP8488889U patent/JPH0323945U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104009010A (en) * | 2013-02-27 | 2014-08-27 | 株式会社电装 | Semiconductor device |
JP2014165452A (en) * | 2013-02-27 | 2014-09-08 | Denso Corp | Semiconductor device |