JPS62152451U - - Google Patents
Info
- Publication number
- JPS62152451U JPS62152451U JP4048386U JP4048386U JPS62152451U JP S62152451 U JPS62152451 U JP S62152451U JP 4048386 U JP4048386 U JP 4048386U JP 4048386 U JP4048386 U JP 4048386U JP S62152451 U JPS62152451 U JP S62152451U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- mounting surface
- terminal conductor
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示し、ａが上面図
、ｂが正面図、ｃが側面図、第２図は従来例の斜
視図、第３図は従来例のプリント板装着状態を示
す斜視図、第４図は第３図と異なる装着状態を示
す側面図、第５図は本考案の一実施例のプリント
板装着状態を示す側面図、第６図は第５図と異な
る装着状態を示す側面図である。
１：樹脂封止半導体装置、２：端子導体、３：
樹脂体、３２：冷却体取付面、３３，３４：樹脂
体突出部、５：冷却体。
Fig. 1 shows an embodiment of the present invention, in which a is a top view, b is a front view, c is a side view, Fig. 2 is a perspective view of a conventional example, and Fig. 3 is a printed board mounted state of the conventional example. Fig. 4 is a side view showing a mounting state different from Fig. 3; Fig. 5 is a side view showing a printed board mounting state of an embodiment of the present invention; Fig. 6 is a side view showing a mounting state different from Fig. It is a side view which shows a state. 1: Resin-sealed semiconductor device, 2: Terminal conductor, 3:
Resin body, 32: Cooling body mounting surface, 33, 34: Resin body protrusion, 5: Cooling body.
Claims (1)
されるものにおいて、端子導体の冷却体取付面延
長側および側方に樹脂体の突出部が設けられたこ
とを特徴とする樹脂封止半導体装置。 1. A resin-sealed semiconductor device in which a terminal conductor is drawn out parallel to a mounting surface to a cooling body, and a resin-sealed semiconductor device is provided with a protruding portion of a resin body on an extension side of the cooling body mounting surface and on a side of the terminal conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4048386U JPS62152451U (en) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4048386U JPS62152451U (en) | 1986-03-19 | 1986-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62152451U true JPS62152451U (en) | 1987-09-28 |
Family
ID=30854608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4048386U Pending JPS62152451U (en) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62152451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031765A (en) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | Power module and inverter |
-
1986
- 1986-03-19 JP JP4048386U patent/JPS62152451U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031765A (en) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | Power module and inverter |