JPH0328751U - - Google Patents

Info

Publication number
JPH0328751U
JPH0328751U JP8971489U JP8971489U JPH0328751U JP H0328751 U JPH0328751 U JP H0328751U JP 8971489 U JP8971489 U JP 8971489U JP 8971489 U JP8971489 U JP 8971489U JP H0328751 U JPH0328751 U JP H0328751U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
hole
circuit device
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8971489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8971489U priority Critical patent/JPH0328751U/ja
Publication of JPH0328751U publication Critical patent/JPH0328751U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の半導体集積回路装
置を示す斜視図、第2図は第1図の半導体集積回
路装置をプリント基板の端子孔に取付けた時の裏
側から拡大して見た斜視図、第3図は従来の半導
体集積回路装置の斜視図である。 1……半導体集積回路パツケージ本体、2,2
′……ピン端子、3……ピン端子先端部分の主面
の穴、4……プリント基板。
Fig. 1 is a perspective view showing a semiconductor integrated circuit device according to an embodiment of the present invention, and Fig. 2 is an enlarged view from the back side of the semiconductor integrated circuit device of Fig. 1 when it is installed in a terminal hole of a printed circuit board. A perspective view, FIG. 3 is a perspective view of a conventional semiconductor integrated circuit device. 1... Semiconductor integrated circuit package body, 2, 2
'...Pin terminal, 3...Hole on the main surface of the tip of the pin terminal, 4...Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路パツケージから引き出された外
部リードの先端部分に穴が形成されていることを
特徴とする半導体集積回路装置。
A semiconductor integrated circuit device characterized in that a hole is formed at the tip of an external lead pulled out from a semiconductor integrated circuit package.
JP8971489U 1989-07-28 1989-07-28 Pending JPH0328751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8971489U JPH0328751U (en) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8971489U JPH0328751U (en) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328751U true JPH0328751U (en) 1991-03-22

Family

ID=31639283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8971489U Pending JPH0328751U (en) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328751U (en)

Similar Documents

Publication Publication Date Title
JPH0328751U (en)
JPH0340793U (en)
JPH0392054U (en)
JPS61203578U (en)
JPH0374489U (en)
JPH0336140U (en)
JPS62152451U (en)
JPH0275744U (en)
JPH0463147U (en)
JPH0272554U (en)
JPH0292944U (en)
JPH0236050U (en)
JPH0474457U (en)
JPH0438057U (en)
JPH0281026U (en)
JPH0442752U (en)
JPH0485742U (en)
JPH0444161U (en)
JPH02137052U (en)
JPH02108345U (en)
JPS62184774U (en)
JPH0371653U (en)
JPH0323945U (en)
JPH02140858U (en)
JPH02136357U (en)