JPH0236050U - - Google Patents
Info
- Publication number
- JPH0236050U JPH0236050U JP11575388U JP11575388U JPH0236050U JP H0236050 U JPH0236050 U JP H0236050U JP 11575388 U JP11575388 U JP 11575388U JP 11575388 U JP11575388 U JP 11575388U JP H0236050 U JPH0236050 U JP H0236050U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- leads
- view
- holes
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図ａ，ｂ，ｃはそれぞれ第１図の集積回路のＡ
方向から見た正面図、Ｂ方向から見た側面図及び
上面図、第３図は面実装用の集積回路に適用した
場合を示す斜視図、第４図は従来の集積回路の外
観を示す斜視図、第５図ａ，ｂはオツシロスコー
プのプローブの形状を示す外観図である。
１……ＩＣ（集積回路）本体、２……リード、
３……貫通孔、なお、図中同一符号は同一または
相当部分を示す。
Fig. 1 is a perspective view showing an embodiment of this invention, and Fig. 2 a, b, and c are respectively A of the integrated circuit of Fig.
A front view as seen from direction B, a side view and a top view as seen from direction B, FIG. 3 is a perspective view showing the case where it is applied to a surface-mounted integrated circuit, and FIG. 4 is a perspective view showing the appearance of a conventional integrated circuit. 5A and 5B are external views showing the shape of the probe of the oscilloscope. 1...IC (integrated circuit) body, 2...Lead,
3...Through hole. Note that the same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
有した集積回路において、前記リードに貫通孔を
設けたことを特徴とする集積回路。 1. An integrated circuit having a plurality of leads mounted on a printed circuit board, wherein the leads are provided with through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11575388U JPH0236050U (en) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11575388U JPH0236050U (en) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236050U true JPH0236050U (en) | 1990-03-08 |
Family
ID=31357688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11575388U Pending JPH0236050U (en) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236050U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018078214A (en) * | 2016-11-10 | 2018-05-17 | 富士電機株式会社 | Semiconductor device |
-
1988
- 1988-09-02 JP JP11575388U patent/JPH0236050U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018078214A (en) * | 2016-11-10 | 2018-05-17 | 富士電機株式会社 | Semiconductor device |