JPS6365266U - - Google Patents
Info
- Publication number
- JPS6365266U JPS6365266U JP16051286U JP16051286U JPS6365266U JP S6365266 U JPS6365266 U JP S6365266U JP 16051286 U JP16051286 U JP 16051286U JP 16051286 U JP16051286 U JP 16051286U JP S6365266 U JPS6365266 U JP S6365266U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- notch
- circuit board
- printed circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂ，ｃは本考案の一実施例における
電解コンデンサ取付装置の分解斜視図、平面図、
断面図、第２図ａ，ｂは本考案の他の実施例を示
す分解斜視図、断面図、第３図ａ，ｂは従来の電
解コンデンサ取付装置の斜視図である。
１……プリント基板、２……電解コンデンサ本
体、３……穴、４……切欠き、７……接着剤。
Figures 1a, b, and c are exploded perspective views and plan views of an electrolytic capacitor mounting device according to an embodiment of the present invention;
2A and 2B are exploded perspective views and sectional views showing another embodiment of the present invention, and FIGS. 3A and 3B are perspective views of a conventional electrolytic capacitor mounting device. 1... Printed circuit board, 2... Electrolytic capacitor body, 3... Hole, 4... Notch, 7... Adhesive.
Claims (1)
さの穴もしくは切欠きをプリント基板に設け、こ
の穴もしくは切欠きに挿入された電解コンデンサ
本体をプリント基板に接着剤で固定した電解コン
デンサ取付装置。 An electrolytic capacitor mounting device in which a hole or notch of approximately the same size as the rectangular cross section of the electrolytic capacitor body is provided on the printed circuit board, and the electrolytic capacitor body inserted into the hole or notch is fixed to the printed circuit board with adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051286U JPS6365266U (en) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051286U JPS6365266U (en) | 1986-10-20 | 1986-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6365266U true JPS6365266U (en) | 1988-04-30 |
Family
ID=31085964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16051286U Pending JPS6365266U (en) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014143379A (en) * | 2013-01-25 | 2014-08-07 | Canon Inc | Mounting substrate and mounting method of electronic component |
-
1986
- 1986-10-20 JP JP16051286U patent/JPS6365266U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014143379A (en) * | 2013-01-25 | 2014-08-07 | Canon Inc | Mounting substrate and mounting method of electronic component |