JPH0434766U - - Google Patents
Info
- Publication number
- JPH0434766U JPH0434766U JP7616090U JP7616090U JPH0434766U JP H0434766 U JPH0434766 U JP H0434766U JP 7616090 U JP7616090 U JP 7616090U JP 7616090 U JP7616090 U JP 7616090U JP H0434766 U JPH0434766 U JP H0434766U
- Authority
- JP
- Japan
- Prior art keywords
- land
- circuit board
- printed circuit
- connection structure
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図及び第２図はこの考案に係るプリント基
板のパターンの接続構造の実施例を示し、第１図
ａは側断面図、第１図ｂはランドの斜視図、第２
図はこの考案の他の実施例を示すランドの斜視図
、第３図は従来の実施例を示す側断面図である。
主の符号の説明、１……プリント基板、２，３
……ランド、４……スルーホール、６……リード
線、７，８……半田、９……スリツト。
1 and 2 show an embodiment of the connection structure of printed circuit board patterns according to this invention, in which FIG. 1a is a side sectional view, FIG. 1b is a perspective view of the land, and FIG.
The figure is a perspective view of a land showing another embodiment of this invention, and FIG. 3 is a side sectional view showing a conventional embodiment. Explanation of main symbols, 1...Printed circuit board, 2, 3
...Land, 4...Through hole, 6...Lead wire, 7, 8...Solder, 9...Slit.
Claims (1)
側のランドをリード線を介して接続するようにし
たプリント基板のパターン接続構造において、 前記部品面側のランドに半田の付着を避けるた
めのスリツトを形成したことを特徴とするプリン
ト基板のパターン接続構造。[Claim for Utility Model Registration] In a printed circuit board pattern connection structure in which a land on the component side and a land on the solder side of a double-sided printed circuit board are connected via a lead wire, solder is applied to the land on the component side. A printed circuit board pattern connection structure characterized by having slits formed to prevent adhesion of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7616090U JPH0434766U (en) | 1990-07-19 | 1990-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7616090U JPH0434766U (en) | 1990-07-19 | 1990-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434766U true JPH0434766U (en) | 1992-03-23 |
Family
ID=31617380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7616090U Pending JPH0434766U (en) | 1990-07-19 | 1990-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434766U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270426A (en) * | 2007-04-18 | 2008-11-06 | Alps Electric Co Ltd | Electric component module |
-
1990
- 1990-07-19 JP JP7616090U patent/JPH0434766U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270426A (en) * | 2007-04-18 | 2008-11-06 | Alps Electric Co Ltd | Electric component module |