JPH03113869U - - Google Patents
Info
- Publication number
- JPH03113869U JPH03113869U JP2411390U JP2411390U JPH03113869U JP H03113869 U JPH03113869 U JP H03113869U JP 2411390 U JP2411390 U JP 2411390U JP 2411390 U JP2411390 U JP 2411390U JP H03113869 U JPH03113869 U JP H03113869U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder resist
- resist layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第1図a,bは、本考案の第1の実施例の要部
平面図及びA−A′線断面図、第2図は第1図a
,bの印刷配線板に部品を実装した断面図、第3
図は本考案の第2の実施例の要部平面図、第4図
a,bは従来の印刷配線板の一例の要部平面図及
びB−B′線断面図、第5図は第4図a,bの印
刷配線板に部品を実装した断面図である。
1a,1b……スルーホールランド、2……半
田レジスト層、3,13……シルク印刷層、4a
,4b……部品リード、5……基板、6……半田
、7……半田ブリツジ。
Figures 1a and b are a plan view of essential parts and a sectional view taken along line A-A' of the first embodiment of the present invention, and Figure 2 is a view of Figure 1a.
, b is a cross-sectional view of parts mounted on the printed wiring board, 3rd
The figure is a plan view of the main part of the second embodiment of the present invention, FIGS. FIG. 3 is a cross-sectional view of components mounted on the printed wiring board of FIGS. a and b; 1a, 1b...Through hole land, 2...Solder resist layer, 3, 13...Silk printing layer, 4a
, 4b...Component lead, 5... Board, 6... Solder, 7... Solder bridge.
Claims (1)
形成された印刷配線板において、前記3ピンラジ
アル部品リード用のうちの中央に部品リード用ス
ルーホールの部品実装面側のスルーホールランド
上に半田レジスト層と該半田レジスト層の上に塗
布されたシルク印刷層とを具備したことを特徴と
する印刷配線板。 In a printed wiring board in which through-holes for 3-pin radial component leads are formed, a solder resist layer is formed on the through-hole land on the component mounting surface side of the component lead through-hole in the center of the 3-pin radial component lead. A printed wiring board comprising a silk printing layer coated on the solder resist layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2411390U JPH03113869U (en) | 1990-03-09 | 1990-03-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2411390U JPH03113869U (en) | 1990-03-09 | 1990-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03113869U true JPH03113869U (en) | 1991-11-21 |
Family
ID=31527085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2411390U Pending JPH03113869U (en) | 1990-03-09 | 1990-03-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03113869U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158429A (en) * | 2000-11-16 | 2002-05-31 | Murata Mfg Co Ltd | Structure for mounting component |
-
1990
- 1990-03-09 JP JP2411390U patent/JPH03113869U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158429A (en) * | 2000-11-16 | 2002-05-31 | Murata Mfg Co Ltd | Structure for mounting component |
JP4529279B2 (en) * | 2000-11-16 | 2010-08-25 | 株式会社村田製作所 | Component mounting structure |