JPH0286176U - - Google Patents
Info
- Publication number
- JPH0286176U JPH0286176U JP16709188U JP16709188U JPH0286176U JP H0286176 U JPH0286176 U JP H0286176U JP 16709188 U JP16709188 U JP 16709188U JP 16709188 U JP16709188 U JP 16709188U JP H0286176 U JPH0286176 U JP H0286176U
- Authority
- JP
- Japan
- Prior art keywords
- rounds
- holes
- wiring board
- metal foil
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案実施例の平面構造を示す図、第
２図は本考案実施例の断面構造を示す図、第３図
は本考案応用例の平面構造を示す図、第４図は従
来例の平面構造を示す図、第５図は従来例の断面
構造を示す図である。
１……チツプ部品、２……ハンダ、３，３′…
…銅箔パターン、３ａ……ラウンド、４……基板
、５……スルーホール、６……レジスト。
Fig. 1 is a diagram showing a planar structure of an embodiment of the invention, Fig. 2 is a diagram showing a cross-sectional structure of an embodiment of the invention, Fig. 3 is a diagram showing a planar structure of an applied example of the invention, and Fig. 4 is a diagram showing a conventional example. FIG. 5 is a diagram showing a planar structure of an example, and FIG. 5 is a diagram showing a cross-sectional structure of a conventional example. 1... Chip parts, 2... Solder, 3, 3'...
...Copper foil pattern, 3a...Round, 4...Substrate, 5...Through hole, 6...Resist.
Claims (1)
あるラウンドとが共通の金属箔上に隣接した構造
のプリント配線板において、上記金属箔上のスル
ーホールとラウンドとの間にレジスト層が形成さ
れてなるプリント配線板。 A printed wiring board with a structure in which through-holes and rounds, which are soldering points for chip parts, are adjacent to each other on a common metal foil, and a resist layer is formed between the through-holes and rounds on the metal foil. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709188U JPH0286176U (en) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709188U JPH0286176U (en) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286176U true JPH0286176U (en) | 1990-07-09 |
Family
ID=31455071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16709188U Pending JPH0286176U (en) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286176U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133695A (en) * | 1986-11-26 | 1988-06-06 | 三菱電機株式会社 | Printed wiring board |
-
1988
- 1988-12-23 JP JP16709188U patent/JPH0286176U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133695A (en) * | 1986-11-26 | 1988-06-06 | 三菱電機株式会社 | Printed wiring board |