JPS63200775U - - Google Patents
Info
- Publication number
- JPS63200775U JPS63200775U JP9151087U JP9151087U JPS63200775U JP S63200775 U JPS63200775 U JP S63200775U JP 9151087 U JP9151087 U JP 9151087U JP 9151087 U JP9151087 U JP 9151087U JP S63200775 U JPS63200775 U JP S63200775U
- Authority
- JP
- Japan
- Prior art keywords
- conductive part
- circuit board
- printed circuit
- hole
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａ，ｂ及びｃは本考案の一実施例を示す
断面図、裏面図、及び上面図、第２図ａ，ｂ及び
ｃは他の実施例を示す断面図、裏面図及び上面図
、第３図ａ及びｂは従来例を示す断面図及び裏面
図、第４図ａ及びｂは他の従来例を示す断面図及
び裏面図である。
１……プリント基板、２……パターン部、３…
…導電部、４……半田、１０，１０′……透孔。
Figures 1 a, b and c are sectional views, back views and top views showing one embodiment of the present invention, and Figures 2 a, b and c are sectional views, back views and top views showing other embodiments. , FIGS. 3A and 3B are a sectional view and a back view of a conventional example, and FIGS. 4A and 4B are a sectional view and a back view of another conventional example. 1... Printed circuit board, 2... Pattern section, 3...
...Conductive part, 4...Solder, 10, 10'...Through hole.
Claims (1)
銅箔が露出した導電部を設け、この導電部に前記
プリント基板の両面を貫通する透孔を設け、更に
前記導電部に半田を溶着して前記透孔を閉塞若し
くは幅狹としたことを特徴とするテストポイント
。 A conductive part in which the copper foil of the pattern part is exposed is provided on the wiring pattern surface of the printed circuit board, a through hole passing through both sides of the printed circuit board is provided in this conductive part, and solder is welded to the conductive part to form the through hole. A test point characterized by being occluded or narrowed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9151087U JPS63200775U (en) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9151087U JPS63200775U (en) | 1987-06-15 | 1987-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200775U true JPS63200775U (en) | 1988-12-23 |
Family
ID=30952360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9151087U Pending JPS63200775U (en) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200775U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62293793A (en) * | 1986-06-13 | 1987-12-21 | ソニー株式会社 | Printed board |
-
1987
- 1987-06-15 JP JP9151087U patent/JPS63200775U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62293793A (en) * | 1986-06-13 | 1987-12-21 | ソニー株式会社 | Printed board |