JPH02138464U - - Google Patents
Info
- Publication number
- JPH02138464U JPH02138464U JP4696589U JP4696589U JPH02138464U JP H02138464 U JPH02138464 U JP H02138464U JP 4696589 U JP4696589 U JP 4696589U JP 4696589 U JP4696589 U JP 4696589U JP H02138464 U JPH02138464 U JP H02138464U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- sub
- main
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図はその縦断側面図、第３図は従来例を示す
分解斜視図である。
１，２……回路パターン、３……メインＰＣ板
、４……サブＰＣ板、５……通孔、６……導電箔
、７……舌片、８……導電箔、９……半田。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
FIG. 2 is a longitudinal sectional side view thereof, and FIG. 3 is an exploded perspective view showing a conventional example. 1, 2... Circuit pattern, 3... Main PC board, 4... Sub PC board, 5... Through hole, 6... Conductive foil, 7... Tongue piece, 8... Conductive foil, 9... Solder .
Claims (1)
片面又は両面に形成されたメインＰＣ板とサブＰ
Ｃ板とを設け、前記メインＰＣ板と前記サブＰＣ
板との一方に通孔を形成し他方に前記通孔に挿入
される接片を形成し、前記通孔の縁と前記舌片と
に前記回路パターンから連続されて互いに半田で
接続される導電箔を形成したことを特徴とするＰ
Ｃ板接続装置。 Main PC board and sub PC board with circuit patterns connected to electronic components formed on one or both sides.
A C board is provided, and the main PC board and the sub PC board are provided.
A through hole is formed on one side of the plate, and a contact piece inserted into the through hole is formed on the other side, and the edge of the through hole and the tongue piece are continuous from the circuit pattern and are connected to each other by soldering. P characterized by forming a foil
C board connection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4696589U JPH02138464U (en) | 1989-04-21 | 1989-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4696589U JPH02138464U (en) | 1989-04-21 | 1989-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138464U true JPH02138464U (en) | 1990-11-19 |
Family
ID=31562488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4696589U Pending JPH02138464U (en) | 1989-04-21 | 1989-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138464U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914375B2 (en) * | 1978-04-07 | 1984-04-04 | マツコ−ド コ−ポレ−シヨン | energy absorption bumper |
-
1989
- 1989-04-21 JP JP4696589U patent/JPH02138464U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914375B2 (en) * | 1978-04-07 | 1984-04-04 | マツコ−ド コ−ポレ−シヨン | energy absorption bumper |