JPH0359664U - - Google Patents
Info
- Publication number
- JPH0359664U JPH0359664U JP12146189U JP12146189U JPH0359664U JP H0359664 U JPH0359664 U JP H0359664U JP 12146189 U JP12146189 U JP 12146189U JP 12146189 U JP12146189 U JP 12146189U JP H0359664 U JPH0359664 U JP H0359664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pattern wiring
- piece
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の実施例を示すプリント基板
の要部拡大平面図、第２図は、第１図のＡ−Ａ′
線拡大断面図、第３図は、実施例による回路切断
状態を示すプリント基板の要部拡大平面図、第４
図は、第３図のＢ−Ｂ′線拡大断面図、第５図は
、従来例を示すプリント基板の要部拡大平面図で
ある。
１……プリント基板、１′……プリント基板片
、２……銅箔、３……レジスト、４……半田、５
……ジヤンパー線、ａ，ｂ，ｃ，ｄ……パターン
配線。
FIG. 1 is an enlarged plan view of the main parts of a printed circuit board showing an embodiment of the present invention, and FIG.
FIG. 3 is an enlarged line sectional view, and FIG.
The figure is an enlarged sectional view taken along the line B-B' in FIG. 3, and FIG. 5 is an enlarged plan view of the main part of a printed circuit board showing a conventional example. 1... Printed circuit board, 1'... Printed board piece, 2... Copper foil, 3... Resist, 4... Solder, 5
... jumper wire, a, b, c, d... pattern wiring.
Claims (1)
、表面に所定形状のパターン配線が施されたプリ
ント基板片を、該プリント基板の打ち抜き孔に嵌
入し、隣合うパターン配線の端部同士を半田で接
合することにより、上記プリント基板片のパター
ン配線を介して上記プリント基板に形成された回
路を接続するようにしたことを特徴とするプリン
ト基板の回路接続構造。 A piece of printed circuit board that is formed by punching out a predetermined part of a printed circuit board and has a pattern wiring of a predetermined shape on its surface is inserted into the punched hole of the printed circuit board, and the ends of adjacent pattern wiring are joined with solder. A circuit connection structure for a printed circuit board, characterized in that the circuit formed on the printed circuit board is connected through the pattern wiring of the printed circuit board piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146189U JPH0359664U (en) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12146189U JPH0359664U (en) | 1989-10-16 | 1989-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359664U true JPH0359664U (en) | 1991-06-12 |
Family
ID=31669494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12146189U Pending JPH0359664U (en) | 1989-10-16 | 1989-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359664U (en) |
-
1989
- 1989-10-16 JP JP12146189U patent/JPH0359664U/ja active Pending