JPH0330464U - - Google Patents
Info
- Publication number
- JPH0330464U JPH0330464U JP8990489U JP8990489U JPH0330464U JP H0330464 U JPH0330464 U JP H0330464U JP 8990489 U JP8990489 U JP 8990489U JP 8990489 U JP8990489 U JP 8990489U JP H0330464 U JPH0330464 U JP H0330464U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例における側面図、第
２図は本実施例の銅箔を示す平面図、第３図は本
実施例の半田付けの状態を示す平面図、第４図は
従来例の側面図、第５図、第６図はその平面図で
ある。
１……プリント配線基板、２……リード付き部
品、３……リード、７……銅箔。
Fig. 1 is a side view of one embodiment of the present invention, Fig. 2 is a plan view showing the copper foil of this embodiment, Fig. 3 is a plan view showing the soldering state of this embodiment, and Fig. 4 is The side view of the conventional example, and FIGS. 5 and 6 are its plan views. 1...Printed wiring board, 2...Component with leads, 3...Leads, 7...Copper foil.
Claims (1)
上記のリードを内側に曲げる形状に沿わせて銅箔
のパターンを設けたことを特徴とするプリント配
線基板。 A printed wiring board on which a leaded component is mounted, wherein a copper foil pattern is provided along the shape of the lead bent inward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8990489U JPH0330464U (en) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8990489U JPH0330464U (en) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330464U true JPH0330464U (en) | 1991-03-26 |
Family
ID=31639455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8990489U Pending JPH0330464U (en) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330464U (en) |
-
1989
- 1989-07-31 JP JP8990489U patent/JPH0330464U/ja active Pending