JPH0160570U - - Google Patents
Info
- Publication number
- JPH0160570U JPH0160570U JP15641287U JP15641287U JPH0160570U JP H0160570 U JPH0160570 U JP H0160570U JP 15641287 U JP15641287 U JP 15641287U JP 15641287 U JP15641287 U JP 15641287U JP H0160570 U JPH0160570 U JP H0160570U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- copper foil
- protrusion
- hole
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
Description
第１図は本考案の実施例を示す縦断面図、第２
図は本考案の実施例の突起部形状を示す外観図。
１……基材、２……穴、３……突起部、４……
実装部品。
Fig. 1 is a vertical sectional view showing an embodiment of the present invention;
The figure is an external view showing the shape of a protrusion in an embodiment of the present invention. 1...Base material, 2...Hole, 3...Protrusion, 4...
Mounting parts.
Claims (1)
曲げ又は突起部に成型し、その成型した銅箔パタ
ーンにより実装部品の位置決め等ができることを
特徴とする配線板。 A wiring board characterized in that a patterned copper foil at the bottom of a hole of a printed wiring board is bent at a right angle or formed into a protrusion, and the molded copper foil pattern enables positioning of mounted components, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15641287U JPH0160570U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15641287U JPH0160570U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160570U true JPH0160570U (en) | 1989-04-17 |
Family
ID=31434928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15641287U Pending JPH0160570U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160570U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002185090A (en) * | 2000-12-11 | 2002-06-28 | Sansha Electric Mfg Co Ltd | Circuit device and its manufacturing method |
| JP2015056475A (en) * | 2013-09-11 | 2015-03-23 | アンデン株式会社 | Electric device |
-
1987
- 1987-10-12 JP JP15641287U patent/JPH0160570U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002185090A (en) * | 2000-12-11 | 2002-06-28 | Sansha Electric Mfg Co Ltd | Circuit device and its manufacturing method |
| JP2015056475A (en) * | 2013-09-11 | 2015-03-23 | アンデン株式会社 | Electric device |