JPH0367472U - - Google Patents

Info

Publication number
JPH0367472U
JPH0367472U JP12976989U JP12976989U JPH0367472U JP H0367472 U JPH0367472 U JP H0367472U JP 12976989 U JP12976989 U JP 12976989U JP 12976989 U JP12976989 U JP 12976989U JP H0367472 U JPH0367472 U JP H0367472U
Authority
JP
Japan
Prior art keywords
hole
electronic component
electrode pattern
circuit board
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12976989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12976989U priority Critical patent/JPH0367472U/ja
Publication of JPH0367472U publication Critical patent/JPH0367472U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の電子部品の取付構造の実施
例を示す要部の断面図。第2図は、従来例の電子
部品の取付構造を示す要部の断面図。 1……回路基板、2……電子部品、3……電極
パターン、4……貫通孔、5……導電性接続材。
FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the electronic component mounting structure of the present invention. FIG. 2 is a sectional view of main parts showing a conventional electronic component mounting structure. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Electronic component, 3... Electrode pattern, 4... Through hole, 5... Conductive connecting material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 貫通孔が形成されると共に前記貫通孔の両端に
電極パターンが形成された回路基板と、この回路
基板の前記貫通孔内に配置される電子部品と、前
記電極パターン及び前記電子部品の接続電極部を
電気的に接続する導電性接続部材とからなり、前
記電極パターンが貫通孔の内壁の一部を覆うよう
な大きさに形成されていることを特徴とする電子
部品の取付構造。
A circuit board in which a through hole is formed and an electrode pattern is formed at both ends of the through hole, an electronic component disposed in the through hole of this circuit board, and a connecting electrode portion of the electrode pattern and the electronic component. 1. A mounting structure for an electronic component, characterized in that the electrode pattern is formed in a size so as to cover a part of an inner wall of a through hole.
JP12976989U 1989-11-07 1989-11-07 Pending JPH0367472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12976989U JPH0367472U (en) 1989-11-07 1989-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12976989U JPH0367472U (en) 1989-11-07 1989-11-07

Publications (1)

Publication Number Publication Date
JPH0367472U true JPH0367472U (en) 1991-07-01

Family

ID=31677375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12976989U Pending JPH0367472U (en) 1989-11-07 1989-11-07

Country Status (1)

Country Link
JP (1) JPH0367472U (en)

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