JPH0284371U - - Google Patents
Info
- Publication number
- JPH0284371U JPH0284371U JP16414488U JP16414488U JPH0284371U JP H0284371 U JPH0284371 U JP H0284371U JP 16414488 U JP16414488 U JP 16414488U JP 16414488 U JP16414488 U JP 16414488U JP H0284371 U JPH0284371 U JP H0284371U
- Authority
- JP
- Japan
- Prior art keywords
- board
- cover
- printed circuit
- contact
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004382 potting Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
第１図はこの発明の一実施例によるＬＳＩ搭載
プリント基板を示す図、第２図はこの発明の一実
施例によるＬＳＩ搭載プリント基板を示す断面図
、第３図は従来のＬＳＩ搭載プリント基板を示す
図、第４図は従来のＬＳＩにカバーを取り付けた
状態を示す図である。
図において、１はプリント基板、２はＬＳＩソ
ケツト、２ａはＬＳＩソケツト導電部、３はＬＳ
Ｉ、３ａはＬＳＩ導電部、４はカバー、５はポツ
テイング材である。なお、図中、同一符号は同一
又は相当部分を示す。
FIG. 1 is a diagram showing an LSI-mounted printed circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view showing an LSI-mounted printed circuit board according to an embodiment of the present invention, and FIG. 3 is a diagram showing a conventional LSI-mounted printed circuit board. The figure shown in FIG. 4 is a diagram showing a state in which a cover is attached to a conventional LSI. In the figure, 1 is a printed circuit board, 2 is an LSI socket, 2a is an LSI socket conductive part, and 3 is an LS
I and 3a are LSI conductive parts, 4 is a cover, and 5 is a potting material. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
り上記基板に搭載される電気部品と、上記接触部
を覆うカバーとからなり、上記カバー部をポツテ
イング材で覆つたことを特徴とするプリント基板
。 A printed circuit board comprising a board on which components are mounted, an electrical component mounted on the board by contact between conductive parts, and a cover that covers the contact part, the cover part being covered with a potting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16414488U JPH0284371U (en) | 1988-12-19 | 1988-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16414488U JPH0284371U (en) | 1988-12-19 | 1988-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284371U true JPH0284371U (en) | 1990-06-29 |
Family
ID=31449496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16414488U Pending JPH0284371U (en) | 1988-12-19 | 1988-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284371U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012588A (en) * | 2005-05-31 | 2007-01-18 | Fujitsu Component Ltd | Cable connector for balanced transmission |
-
1988
- 1988-12-19 JP JP16414488U patent/JPH0284371U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012588A (en) * | 2005-05-31 | 2007-01-18 | Fujitsu Component Ltd | Cable connector for balanced transmission |
| JP4664201B2 (en) * | 2005-05-31 | 2011-04-06 | 富士通コンポーネント株式会社 | Cable connector for balanced transmission |