JPH01140880U - - Google Patents
Info
- Publication number
- JPH01140880U JPH01140880U JP3771988U JP3771988U JPH01140880U JP H01140880 U JPH01140880 U JP H01140880U JP 3771988 U JP3771988 U JP 3771988U JP 3771988 U JP3771988 U JP 3771988U JP H01140880 U JPH01140880 U JP H01140880U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- thick film
- insulator
- configuring
- surrounded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例による厚膜基板を
示す斜視図、第２図は従来の厚膜基板を示す斜視
図である。
図中、１は基板、２は導体パターン、４はチツ
プ部品、５は半田、６は絶縁体である。尚、図中
同一符号は同一または相当部分を示す。
FIG. 1 is a perspective view showing a thick film substrate according to an embodiment of this invention, and FIG. 2 is a perspective view showing a conventional thick film substrate. In the figure, 1 is a substrate, 2 is a conductor pattern, 4 is a chip component, 5 is solder, and 6 is an insulator. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
印刷された厚膜基板において、上記導体パターン
上に、チツプ部品を固着するためのスペースを残
して絶縁体により囲みを形成したことを特徴とす
る厚膜基板。 A thick film substrate on which a conductor pattern for configuring a circuit is printed, characterized in that the conductor pattern is surrounded by an insulator, leaving a space for fixing chip components. membrane substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3771988U JPH01140880U (en) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3771988U JPH01140880U (en) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140880U true JPH01140880U (en) | 1989-09-27 |
Family
ID=31264294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3771988U Pending JPH01140880U (en) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140880U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0595176A (en) * | 1991-10-02 | 1993-04-16 | Matsushita Electric Ind Co Ltd | Printed board for high-frequency amplifying module |
-
1988
- 1988-03-22 JP JP3771988U patent/JPH01140880U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0595176A (en) * | 1991-10-02 | 1993-04-16 | Matsushita Electric Ind Co Ltd | Printed board for high-frequency amplifying module |