JPS61207077U - - Google Patents
Info
- Publication number
- JPS61207077U JPS61207077U JP9167285U JP9167285U JPS61207077U JP S61207077 U JPS61207077 U JP S61207077U JP 9167285 U JP9167285 U JP 9167285U JP 9167285 U JP9167285 U JP 9167285U JP S61207077 U JPS61207077 U JP S61207077U
- Authority
- JP
- Japan
- Prior art keywords
- insertion hole
- component insertion
- copper foil
- solder resist
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例のプリント基板の
平面図、第２図は同実施例のプリント基板に部品
を半田付けした状態を示す斜視図、第３図は従来
例のプリント基板の平面図、第４図は従来例のプ
リント基板に部品を半田付けした状態を示す斜視
図である。
１……絶縁基板、２……部品挿入孔、３……銅
箔部、４……ソルダーレジスト塗布部、５……銅
箔露出部。
Figure 1 is a plan view of a printed circuit board according to an embodiment of this invention, Figure 2 is a perspective view showing parts soldered to the printed circuit board of the same embodiment, and Figure 3 is a plane view of a conventional printed circuit board. FIG. 4 is a perspective view showing a state in which components are soldered to a conventional printed circuit board. 1...Insulating board, 2...Component insertion hole, 3...Copper foil part, 4...Solder resist coating part, 5...Copper foil exposed part.
Claims (1)
と、前記部品挿入孔の周辺に設けた銅箔とを備え
たプリント基板において、前記部品挿入孔の周辺
の前記銅箔上にソルダーレジストを塗布し、かつ
前記部品挿入孔の周辺に接する少なくとも１箇所
で前記ソルダーレジストを塗布しない銅箔露出部
を設けてなるプリント基板。 In a printed circuit board comprising an insulating substrate, a component insertion hole provided in the insulating substrate, and a copper foil provided around the component insertion hole, a solder resist is applied on the copper foil around the component insertion hole. and at least one exposed copper foil portion in contact with the periphery of the component insertion hole where the solder resist is not applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9167285U JPS61207077U (en) | 1985-06-17 | 1985-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9167285U JPS61207077U (en) | 1985-06-17 | 1985-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207077U true JPS61207077U (en) | 1986-12-27 |
Family
ID=30647772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9167285U Pending JPS61207077U (en) | 1985-06-17 | 1985-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207077U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10973130B2 (en) | 2018-05-22 | 2021-04-06 | Fanuc Corporation | Printed wiring board |
-
1985
- 1985-06-17 JP JP9167285U patent/JPS61207077U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10973130B2 (en) | 2018-05-22 | 2021-04-06 | Fanuc Corporation | Printed wiring board |
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