JPS63100871U - - Google Patents

Info

Publication number
JPS63100871U
JPS63100871U JP19522986U JP19522986U JPS63100871U JP S63100871 U JPS63100871 U JP S63100871U JP 19522986 U JP19522986 U JP 19522986U JP 19522986 U JP19522986 U JP 19522986U JP S63100871 U JPS63100871 U JP S63100871U
Authority
JP
Japan
Prior art keywords
land
positioning
determining
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19522986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19522986U priority Critical patent/JPS63100871U/ja
Publication of JPS63100871U publication Critical patent/JPS63100871U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す図、第2図は本
考案の他の実施例を示す図、第3図は従来の表面
実装部品を実装するランドを示す図、第4図は従
来の表面実装部品の実装方法を説明するための図
である。 第1図、第2図において、10は基板、11は
パターン、12はランド、12aは位置決め、1
3は表面実装部品である。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the present invention, FIG. 3 is a diagram showing a land on which a conventional surface mount component is mounted, and FIG. 4 is a diagram showing a conventional land. FIG. 2 is a diagram for explaining a method for mounting surface-mounted components. 1 and 2, 10 is a substrate, 11 is a pattern, 12 is a land, 12a is a positioning device, 1
3 is a surface mount component.

Claims (1)

【実用新案登録請求の範囲】 表面実装部品の実装を行なうプリント板のラン
ドであつて、 上記実装部品13の半田付け位置を決める位置
決め12aをランド12上に設けたことを特徴と
する位置決め付きランド構造。
[Claims for Utility Model Registration] A land of a printed circuit board on which surface-mounted components are mounted, characterized in that a positioning 12a for determining the soldering position of the mounted component 13 is provided on the land 12. structure.
JP19522986U 1986-12-20 1986-12-20 Pending JPS63100871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19522986U JPS63100871U (en) 1986-12-20 1986-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19522986U JPS63100871U (en) 1986-12-20 1986-12-20

Publications (1)

Publication Number Publication Date
JPS63100871U true JPS63100871U (en) 1988-06-30

Family

ID=31152930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19522986U Pending JPS63100871U (en) 1986-12-20 1986-12-20

Country Status (1)

Country Link
JP (1) JPS63100871U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013132569A1 (en) * 2012-03-05 2013-09-12 三菱電機株式会社 Semiconductor device
JPWO2013132569A1 (en) * 2012-03-05 2015-07-30 三菱電機株式会社 Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013132569A1 (en) * 2012-03-05 2013-09-12 三菱電機株式会社 Semiconductor device
CN104170534A (en) * 2012-03-05 2014-11-26 三菱电机株式会社 Semiconductor device
JPWO2013132569A1 (en) * 2012-03-05 2015-07-30 三菱電機株式会社 Semiconductor device

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