JPH0426566U - - Google Patents
Info
- Publication number
- JPH0426566U JPH0426566U JP6728690U JP6728690U JPH0426566U JP H0426566 U JPH0426566 U JP H0426566U JP 6728690 U JP6728690 U JP 6728690U JP 6728690 U JP6728690 U JP 6728690U JP H0426566 U JPH0426566 U JP H0426566U
- Authority
- JP
- Japan
- Prior art keywords
- board
- sub
- supports
- hereinafter referred
- main board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案プリント板支柱の構成図でａは
平面図、ｂは側面図。第２図は実施例の平面図。
第３図は実施例の側面図。第４図は従来方法の側
面図。
１……主基板、２……副基板、３……絶縁シー
ト、４……部品、５……部品リード及び信号ポイ
ント、６……接着剤、７……信号ケーブル、８…
…プリント板支柱、９……スルーホール、１０…
…パターンランド、１１……副基板受溝、１２…
…小基板、１３……支柱、１４，１５……ジヤン
パー線、１６……主基板上の部品、１７……主基
板上のパターンランド、１８……主基板上の信号
ポイント。
FIG. 1 is a configuration diagram of the printed board support of the present invention, in which a is a plan view and b is a side view. FIG. 2 is a plan view of the embodiment.
FIG. 3 is a side view of the embodiment. FIG. 4 is a side view of the conventional method. DESCRIPTION OF SYMBOLS 1...Main board, 2...Subboard, 3...Insulating sheet, 4...Components, 5...Component leads and signal points, 6...Adhesive, 7...Signal cable, 8...
...Printed board support, 9...Through hole, 10...
...Pattern land, 11...Sub board receiving groove, 12...
...Small board, 13... Support, 14, 15... Jumper wire, 16... Components on main board, 17... Pattern land on main board, 18... Signal point on main board.
Claims (1)
板）に副基板を搭載する構造において、パターン
ランドとスルーホール及び副基板受溝を有する小
基板に絶縁物又は導電物の支柱（以下支柱）を、
接着剤又ははんだ付で複数個取付た構造のプリン
ト板支柱により任意の大きさの副基板を主基板の
任意の場所に搭載することを特徴とする副基板の
取付構造。 In a structure in which a sub-board is mounted on a multi-layer component-mounted printed wiring board (hereinafter referred to as the main board), supports of insulating or conductive material (hereinafter referred to as supports) are placed on a small board having pattern lands, through-holes, and sub-board receiving grooves.
A sub-board mounting structure characterized in that a sub-board of any size can be mounted at any location on a main board using a plurality of printed board supports attached with adhesive or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6728690U JPH0426566U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6728690U JPH0426566U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426566U true JPH0426566U (en) | 1992-03-03 |
Family
ID=31600730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6728690U Pending JPH0426566U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426566U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250836A (en) * | 1995-03-08 | 1996-09-27 | Fujitsu Ltd | Additional component mounting structure for printed wiring board |
-
1990
- 1990-06-27 JP JP6728690U patent/JPH0426566U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250836A (en) * | 1995-03-08 | 1996-09-27 | Fujitsu Ltd | Additional component mounting structure for printed wiring board |
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