JPS62178574U - - Google Patents
Info
- Publication number
- JPS62178574U JPS62178574U JP6706286U JP6706286U JPS62178574U JP S62178574 U JPS62178574 U JP S62178574U JP 6706286 U JP6706286 U JP 6706286U JP 6706286 U JP6706286 U JP 6706286U JP S62178574 U JPS62178574 U JP S62178574U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- electronic component
- printed wiring
- mounting land
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Description
第１図はこの考案の一実施例を示す部分平面図
、第２図は従来の印刷配線板を示す部分平面図で
ある。
図において、１は絶縁基板、２は銅箔（導電箔
）パターン、３は電子部品取付けランド、４は電
子部品、７は捨てランドである。図中同一符号は
同一或は相当部分を示す。
FIG. 1 is a partial plan view showing an embodiment of this invention, and FIG. 2 is a partial plan view showing a conventional printed wiring board. In the figure, 1 is an insulating substrate, 2 is a copper foil (conductive foil) pattern, 3 is an electronic component mounting land, 4 is an electronic component, and 7 is a waste land. The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
導電箔パターンを形成し、上記電子部品取付けラ
ンドに電子部品をリフロー法で半田付けを行なう
ようにした印刷配線板において、上記電子部品取
付けランドの近傍に電子部品が接続されない導電
箔パターンの捨てランドを設けたことを特徴とす
る印刷配線板。 In a printed wiring board in which a conductive foil pattern having an electronic component mounting land is formed on a discontinuous board, and electronic components are soldered to the electronic component mounting land by a reflow method, the electronic component mounting land is located near the electronic component mounting land. A printed wiring board characterized in that a conductive foil pattern discarded land to which electronic components are not connected is provided on the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706286U JPS62178574U (en) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706286U JPS62178574U (en) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178574U true JPS62178574U (en) | 1987-11-12 |
Family
ID=30905626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6706286U Pending JPS62178574U (en) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178574U (en) |
-
1986
- 1986-04-30 JP JP6706286U patent/JPS62178574U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62178574U (en) | ||
| JPS62178575U (en) | ||
| JPS60176577U (en) | Printed board | |
| JPS6329993U (en) | ||
| JPS59121175U (en) | terminal mounting device | |
| JPS63100871U (en) | ||
| JPH03102764U (en) | ||
| JPH0487681U (en) | ||
| JPS6338368U (en) | ||
| JPS61100168U (en) | ||
| JPS6230380U (en) | ||
| JPS6336076U (en) | ||
| JPS62157184U (en) | ||
| JPH02138462U (en) | ||
| JPS6357775U (en) | ||
| JPS62162871U (en) | ||
| JPS61207077U (en) | ||
| JPS6232573U (en) | ||
| JPS63197334U (en) | ||
| JPS63136352U (en) | ||
| JPS61104585U (en) | ||
| JPS5878683U (en) | printed wiring board | |
| JPS61131871U (en) | ||
| JPS61173170U (en) | ||
| JPS6367280U (en) |