JPS62162871U - - Google Patents
Info
- Publication number
- JPS62162871U JPS62162871U JP5032086U JP5032086U JPS62162871U JP S62162871 U JPS62162871 U JP S62162871U JP 5032086 U JP5032086 U JP 5032086U JP 5032086 U JP5032086 U JP 5032086U JP S62162871 U JPS62162871 U JP S62162871U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- wiring
- corresponding opening
- wiring pattern
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例に係わる回路基板を示
す平面図。第２図は第１図の基板に電子部品を仮
固定した状態を示す平面図、第３図は電子部品の
半田付け後における第２図の―線断面図、第
４図は従来の回路基板に電子部品を仮固定した状
態を示す平面図、第５図は第４図の―線に相
等する断面図である。
１……絶縁基板、２……ランド部、３……配線
部、４……配線パターン、５……半田非付着性絶
縁層、７……電子部品、８……半田、９ａ……ラ
ンド部対応開孔、９ｂ……配線部対応開孔。
FIG. 1 is a plan view showing a circuit board according to an embodiment of the present invention. Figure 2 is a plan view showing electronic components temporarily fixed to the board in Figure 1, Figure 3 is a sectional view taken along the line - - in Figure 2 after the electronic components have been soldered, and Figure 4 is a conventional circuit board. FIG. 5 is a plan view showing a state in which electronic components are temporarily fixed in place, and FIG. 5 is a cross-sectional view corresponding to the line - - in FIG. DESCRIPTION OF SYMBOLS 1...Insulating substrate, 2...Land part, 3...Wiring part, 4...Wiring pattern, 5...Solder non-adhesive insulating layer, 7...Electronic component, 8...Solder, 9a...Land part Corresponding opening, 9b...Opening corresponding to the wiring part.
Claims (1)
パターン４と、この配線パターン４を選択的に被
覆するように設けられた半田非付着性絶縁層５と
、前記配線パターン４に半田で結合された電子部
品７とを有する回路装置において、 前記配線パターン４が前記電子部品７を固着す
るためのランド部２と前記ランド部２よりも狭い
幅を有して前記ランド部２から引き出されている
配線部３とを備え、 前記絶縁層５が前記ランド部２を露出させるよ
うに設けられたランド部対応開孔９ａと、前記ラ
ンド部対応開孔９ａの幅Ｗ１よりも狭い幅Ｗ２を
有して前記ランド部対応開孔９ａに連続的に設け
られ且つ前記配線部３の一部を露出させるように
設けられた配線部対応開孔９ｂとを備えているこ
とを特徴とする回路装置。[Claims for Utility Model Registration] An insulating substrate 1, a wiring pattern 4 provided on this substrate 1, a non-solder adhesion insulating layer 5 provided so as to selectively cover this wiring pattern 4, In a circuit device having an electronic component 7 coupled to the wiring pattern 4 with solder, the wiring pattern 4 has a land portion 2 for fixing the electronic component 7 and a width narrower than the land portion 2. A wiring portion 3 drawn out from the land portion 2, a land portion corresponding opening 9a provided so that the insulating layer 5 exposes the land portion 2, and a width of the land portion corresponding opening 9a. A wiring part corresponding opening 9b having a width W2 narrower than W1 and being provided continuously to the land part corresponding opening 9a and exposing a part of the wiring part 3. A circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986050320U JPH0729660Y2 (en) | 1986-04-03 | 1986-04-03 | Circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986050320U JPH0729660Y2 (en) | 1986-04-03 | 1986-04-03 | Circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62162871U true JPS62162871U (en) | 1987-10-16 |
| JPH0729660Y2 JPH0729660Y2 (en) | 1995-07-05 |
Family
ID=30873576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986050320U Expired - Lifetime JPH0729660Y2 (en) | 1986-04-03 | 1986-04-03 | Circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729660Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181374U (en) * | 1979-06-14 | 1980-12-26 | ||
| JPS57193253U (en) * | 1981-06-03 | 1982-12-07 |
-
1986
- 1986-04-03 JP JP1986050320U patent/JPH0729660Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181374U (en) * | 1979-06-14 | 1980-12-26 | ||
| JPS57193253U (en) * | 1981-06-03 | 1982-12-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729660Y2 (en) | 1995-07-05 |
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