JPS5933274U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5933274U
JPS5933274U JP12989582U JP12989582U JPS5933274U JP S5933274 U JPS5933274 U JP S5933274U JP 12989582 U JP12989582 U JP 12989582U JP 12989582 U JP12989582 U JP 12989582U JP S5933274 U JPS5933274 U JP S5933274U
Authority
JP
Japan
Prior art keywords
conductive land
section
frame part
wiring
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12989582U
Other languages
Japanese (ja)
Inventor
尚文 田中
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP12989582U priority Critical patent/JPS5933274U/en
Publication of JPS5933274U publication Critical patent/JPS5933274U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のプリント基板の平面図、第２図は第１図
の基板の側面図、第３図は同じく基板の部分拡大断面図
、第４図は本考案のプリント基板の平面図、第５図は第
４図のプリント基板の平面図、及び第６図は同じくプリ
ント基板の部分拡大断面図である。 １１・・・プリント基板、１２・・・保持フレーム部、
１３・・・配線パターン部、１４．１５・・・導電ラン
ド、１６・・・境界線、１７・・・半田レジスト。FIG. 1 is a plan view of a conventional printed circuit board, FIG. 2 is a side view of the circuit board shown in FIG. 1, FIG. 3 is a partially enlarged cross-sectional view of the same circuit board, and FIG. 5 is a plan view of the printed circuit board shown in FIG. 4, and FIG. 6 is a partially enlarged sectional view of the same printed circuit board. 11... Printed circuit board, 12... Holding frame part,
13... Wiring pattern portion, 14.15... Conductive land, 16... Boundary line, 17... Solder resist.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板を互に切離可能に結合する配線パターン部と保
持フレーム部とにより構成し、導電ランドを形成した前
記配線パターン部に所定部品を半田処理して配線した後
、前記パターン部を前記フレーム部から切り離すプリン
ト配線体において、前記フレーム部には導電ランドが形
成され且つ前記絶縁基板には前記導電ランドの半田付は
部分を残して半田レジストが施され、前記フレーム部の
導電ランドにより前記絶縁基板の反りを抑制したことを
特徴とするプリント基板。It is composed of a wiring pattern section and a holding frame section that releasably couple insulating substrates to each other, and after soldering and wiring a predetermined component to the wiring pattern section on which a conductive land is formed, the pattern section is attached to the frame section. In the printed wiring body to be separated from the frame part, a conductive land is formed on the frame part, and a solder resist is applied to the insulating substrate except for the soldering part of the conductive land, and the conductive land of the frame part A printed circuit board characterized by suppressing board warpage.
JP12989582U 1982-08-27 1982-08-27 Printed board Pending JPS5933274U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12989582U JPS5933274U (en) 1982-08-27 1982-08-27 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12989582U JPS5933274U (en) 1982-08-27 1982-08-27 Printed board

Publications (1)

Publication Number Publication Date
JPS5933274U true JPS5933274U (en) 1984-03-01

Family

ID=30294171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12989582U Pending JPS5933274U (en) 1982-08-27 1982-08-27 Printed board

Country Status (1)

Country Link
JP (1) JPS5933274U (en)

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