JPS60151166U - Printed board - Google Patents

Printed board

Info

Publication number
JPS60151166U
JPS60151166U JP3948584U JP3948584U JPS60151166U JP S60151166 U JPS60151166 U JP S60151166U JP 3948584 U JP3948584 U JP 3948584U JP 3948584 U JP3948584 U JP 3948584U JP S60151166 U JPS60151166 U JP S60151166U
Authority
JP
Japan
Prior art keywords
printed board
printed circuit
chip components
substrate
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3948584U
Other languages
Japanese (ja)
Inventor
健久 石井
Original Assignee
日本ビクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ビクター株式会社 filed Critical 日本ビクター株式会社
Priority to JP3948584U priority Critical patent/JPS60151166U/en
Publication of JPS60151166U publication Critical patent/JPS60151166U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はチップ部品がプリント基板に固定された状態を
示す図、第2図はチップ部品が固定された状態のプリン
ト基板の部分拡大断面図、第3図は本考案になるプリン
ト基板の一実施例のものを示す図、第一4図は本考案に
なるプリント基板の一実施例のものにチップ部品が接着
された状態の部分拡大断面図である。 1・・・基板、2・・・チップ部品、3・・・パターン
、4・・・ハンダ付は箇所4.5a・・・レジスト、6
・・・フラックス、7・・・接着剤、8・・・穴部。
Fig. 1 is a diagram showing a state in which chip components are fixed to a printed circuit board, Fig. 2 is a partial enlarged sectional view of the printed circuit board in a state in which chip components are fixed, and Fig. 3 is a diagram showing a printed circuit board according to the present invention. FIG. 14 is a partially enlarged cross-sectional view of an embodiment of the printed circuit board according to the present invention with chip components bonded to it. 1... Board, 2... Chip component, 3... Pattern, 4... Soldering point 4.5a... Resist, 6
...Flux, 7.Adhesive, 8.Hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品がハンダ付けされるプリント基板において、
基板上に形成されたパターンの前記チップ部品をハンダ
付けするハンダ付は箇所間に介挿されたレジスト層に前
記基板表面に達する穴部を設けたことを特徴とするプリ
ント基板。
On printed circuit boards to which chip components are soldered,
1. A printed circuit board, characterized in that holes reaching the surface of the substrate are provided in a resist layer inserted between soldering points for soldering the chip components in a pattern formed on the substrate.
JP3948584U 1984-03-19 1984-03-19 Printed board Pending JPS60151166U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3948584U JPS60151166U (en) 1984-03-19 1984-03-19 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3948584U JPS60151166U (en) 1984-03-19 1984-03-19 Printed board

Publications (1)

Publication Number Publication Date
JPS60151166U true JPS60151166U (en) 1985-10-07

Family

ID=30547470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3948584U Pending JPS60151166U (en) 1984-03-19 1984-03-19 Printed board

Country Status (1)

Country Link
JP (1) JPS60151166U (en)

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