JPS60151166U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60151166U JPS60151166U JP3948584U JP3948584U JPS60151166U JP S60151166 U JPS60151166 U JP S60151166U JP 3948584 U JP3948584 U JP 3948584U JP 3948584 U JP3948584 U JP 3948584U JP S60151166 U JPS60151166 U JP S60151166U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- printed circuit
- chip components
- substrate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はチップ部品がプリント基板に固定された状態を
示す図、第2図はチップ部品が固定された状態のプリン
ト基板の部分拡大断面図、第3図は本考案になるプリン
ト基板の一実施例のものを示す図、第一4図は本考案に
なるプリント基板の一実施例のものにチップ部品が接着
された状態の部分拡大断面図である。
1・・・基板、2・・・チップ部品、3・・・パターン
、4・・・ハンダ付は箇所4.5a・・・レジスト、6
・・・フラックス、7・・・接着剤、8・・・穴部。Fig. 1 is a diagram showing a state in which chip components are fixed to a printed circuit board, Fig. 2 is a partial enlarged sectional view of the printed circuit board in a state in which chip components are fixed, and Fig. 3 is a diagram showing a printed circuit board according to the present invention. FIG. 14 is a partially enlarged cross-sectional view of an embodiment of the printed circuit board according to the present invention with chip components bonded to it. 1... Board, 2... Chip component, 3... Pattern, 4... Soldering point 4.5a... Resist, 6
...Flux, 7.Adhesive, 8.Hole.
Claims (1)
基板上に形成されたパターンの前記チップ部品をハンダ
付けするハンダ付は箇所間に介挿されたレジスト層に前
記基板表面に達する穴部を設けたことを特徴とするプリ
ント基板。On printed circuit boards to which chip components are soldered,
1. A printed circuit board, characterized in that holes reaching the surface of the substrate are provided in a resist layer inserted between soldering points for soldering the chip components in a pattern formed on the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3948584U JPS60151166U (en) | 1984-03-19 | 1984-03-19 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3948584U JPS60151166U (en) | 1984-03-19 | 1984-03-19 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60151166U true JPS60151166U (en) | 1985-10-07 |
Family
ID=30547470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3948584U Pending JPS60151166U (en) | 1984-03-19 | 1984-03-19 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60151166U (en) |
-
1984
- 1984-03-19 JP JP3948584U patent/JPS60151166U/en active Pending
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