JPS58168170U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS58168170U JPS58168170U JP6480982U JP6480982U JPS58168170U JP S58168170 U JPS58168170 U JP S58168170U JP 6480982 U JP6480982 U JP 6480982U JP 6480982 U JP6480982 U JP 6480982U JP S58168170 U JPS58168170 U JP S58168170U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed board
- component mounting
- mounting position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本案プリント基板の要部断面図、第2図乃至第
4図は同プリント基板に対するチップ部品の取付順序を
示す断面図、第5図は同チップ部品の接着構造の他の例
を示す断面図である。
1・・・・・・基板、2.3・・・・・・導電パターン
、6゜601・・・・・・半田レジスト層、20・・・
・・・裏面印刷層、8・・・・・・接着剤、7.21・
・・・・・凹部、A・・・・・・チップ部品、b、
b・・・・・・リード部。Figure 1 is a cross-sectional view of the main parts of the printed circuit board of the present invention, Figures 2 to 4 are cross-sectional views showing the order in which chip components are attached to the printed circuit board, and Figure 5 is another example of the bonding structure of the chip components. FIG. 1...Substrate, 2.3...Conductive pattern, 6゜601...Solder resist layer, 20...
... Back printing layer, 8 ... Adhesive, 7.21.
... recess, A ... chip component, b,
b...Lead part.
Claims (1)
端部にチップ部品の両端リード部が接続されるプリント
基板において、前記部品装着位置に形成された半田レジ
スト層又は裏面印刷層の接着剤の塗布位置に所定形状の
凹部を設けたことを特徴とするプリント基板。In a printed circuit board in which both end lead parts of a chip component are connected to the respective ends of conductive patterns formed on the left and right sides of a component mounting position, adhesive of a solder resist layer or a back printing layer formed at the component mounting position is used. A printed circuit board characterized in that a recessed portion of a predetermined shape is provided at a coating position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6480982U JPS58168170U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6480982U JPS58168170U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58168170U true JPS58168170U (en) | 1983-11-09 |
Family
ID=30074822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6480982U Pending JPS58168170U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58168170U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827969B2 (en) * | 1977-12-29 | 1983-06-13 | フリ−トガ−ド・インコ−ポレイテツド | disposable fluid filter cartridge |
-
1982
- 1982-04-30 JP JP6480982U patent/JPS58168170U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827969B2 (en) * | 1977-12-29 | 1983-06-13 | フリ−トガ−ド・インコ−ポレイテツド | disposable fluid filter cartridge |
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