JPS58168170U - Printed board - Google Patents

Printed board

Info

Publication number
JPS58168170U
JPS58168170U JP6480982U JP6480982U JPS58168170U JP S58168170 U JPS58168170 U JP S58168170U JP 6480982 U JP6480982 U JP 6480982U JP 6480982 U JP6480982 U JP 6480982U JP S58168170 U JPS58168170 U JP S58168170U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
printed board
component mounting
mounting position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6480982U
Other languages
Japanese (ja)
Inventor
岩崎 勝四郎
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP6480982U priority Critical patent/JPS58168170U/en
Publication of JPS58168170U publication Critical patent/JPS58168170U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本案プリント基板の要部断面図、第2図乃至第
4図は同プリント基板に対するチップ部品の取付順序を
示す断面図、第5図は同チップ部品の接着構造の他の例
を示す断面図である。 1・・・・・・基板、2.3・・・・・・導電パターン
、6゜601・・・・・・半田レジスト層、20・・・
・・・裏面印刷層、8・・・・・・接着剤、7.21・
・・・・・凹部、A・・・・・・チップ部品、b、  
b・・・・・・リード部。
Figure 1 is a cross-sectional view of the main parts of the printed circuit board of the present invention, Figures 2 to 4 are cross-sectional views showing the order in which chip components are attached to the printed circuit board, and Figure 5 is another example of the bonding structure of the chip components. FIG. 1...Substrate, 2.3...Conductive pattern, 6゜601...Solder resist layer, 20...
... Back printing layer, 8 ... Adhesive, 7.21.
... recess, A ... chip component, b,
b...Lead part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品装着位置の左右に形成された導電パターンの夫々の
端部にチップ部品の両端リード部が接続されるプリント
基板において、前記部品装着位置に形成された半田レジ
スト層又は裏面印刷層の接着剤の塗布位置に所定形状の
凹部を設けたことを特徴とするプリント基板。
In a printed circuit board in which both end lead parts of a chip component are connected to the respective ends of conductive patterns formed on the left and right sides of a component mounting position, adhesive of a solder resist layer or a back printing layer formed at the component mounting position is used. A printed circuit board characterized in that a recessed portion of a predetermined shape is provided at a coating position.
JP6480982U 1982-04-30 1982-04-30 Printed board Pending JPS58168170U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6480982U JPS58168170U (en) 1982-04-30 1982-04-30 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6480982U JPS58168170U (en) 1982-04-30 1982-04-30 Printed board

Publications (1)

Publication Number Publication Date
JPS58168170U true JPS58168170U (en) 1983-11-09

Family

ID=30074822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6480982U Pending JPS58168170U (en) 1982-04-30 1982-04-30 Printed board

Country Status (1)

Country Link
JP (1) JPS58168170U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827969B2 (en) * 1977-12-29 1983-06-13 フリ−トガ−ド・インコ−ポレイテツド disposable fluid filter cartridge

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827969B2 (en) * 1977-12-29 1983-06-13 フリ−トガ−ド・インコ−ポレイテツド disposable fluid filter cartridge

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