JPS58170867U - Chip component mounting structure on printed wiring board - Google Patents
Chip component mounting structure on printed wiring boardInfo
- Publication number
- JPS58170867U JPS58170867U JP6706082U JP6706082U JPS58170867U JP S58170867 U JPS58170867 U JP S58170867U JP 6706082 U JP6706082 U JP 6706082U JP 6706082 U JP6706082 U JP 6706082U JP S58170867 U JPS58170867 U JP S58170867U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- wiring board
- printed wiring
- component mounting
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す印刷配線基板のチップ
部品取付部の要部切欠側面図、第２図は従来型の印刷配
線基板のチップ部品取付部の要部切欠側面図、第く図は
同じく他の従来型の印刷配線基板のチップ部品取付部の
要部切欠側面図である。同図中、
１・・・・・・印刷配線基板、２・・・・・・銅箔回路
パターン、３．３′・・・・・・半田メッキ防止層、４
・・・・・・チップ部品、５・・・・・・台部、６・・
・・・・接着層、７・・・・・・半田。FIG. 1 is a cutaway side view of a main part of a chip component mounting portion of a printed wiring board showing an embodiment of the present invention; FIG. 2 is a cutaway side view of a main part of a chip component mounting portion of a conventional printed wiring board; The second figure is a cutaway side view of a main part of a chip component mounting portion of another conventional printed wiring board. In the figure, 1...Printed wiring board, 2...Copper foil circuit pattern, 3.3'...Solder plating prevention layer, 4
...Chip parts, 5...Base, 6...
...Adhesive layer, 7...Solder.
Claims (1)
同様に一回以上の紫外線硬化型樹脂の印刷、硬化をもっ
てチップ部品の接着面に対応する所要の厚みの台部を形
成し、その上面にチップ部品に対する接着層着形成して
なることを特徴とする印刷配線基板のチップ部品取付構
造。Similar to the solder plating prevention layer, UV curable resin is printed and cured one or more times on the chip component mounting area of the printed wiring board to form a base with the required thickness corresponding to the adhesive surface of the chip component, and then A structure for mounting a chip component on a printed wiring board, characterized by forming an adhesive layer on the chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706082U JPS58170867U (en) | 1982-05-07 | 1982-05-07 | Chip component mounting structure on printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706082U JPS58170867U (en) | 1982-05-07 | 1982-05-07 | Chip component mounting structure on printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58170867U true JPS58170867U (en) | 1983-11-15 |
Family
ID=30076901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6706082U Pending JPS58170867U (en) | 1982-05-07 | 1982-05-07 | Chip component mounting structure on printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170867U (en) |
-
1982
- 1982-05-07 JP JP6706082U patent/JPS58170867U/en active Pending
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