JPS5812969U - flexible printed circuit board - Google Patents
flexible printed circuit boardInfo
- Publication number
- JPS5812969U JPS5812969U JP10837581U JP10837581U JPS5812969U JP S5812969 U JPS5812969 U JP S5812969U JP 10837581 U JP10837581 U JP 10837581U JP 10837581 U JP10837581 U JP 10837581U JP S5812969 U JPS5812969 U JP S5812969U
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- plating layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の可撓性印刷配線基板の実装状態を示す断
面図、第２図は本考案の可撓性印刷配線木板の断面図、
第３図、第４図はその実装状態を示す断面図である。
１０・・・・・・基板、１１・・・・・・透孔、１２・
・・・・・メッキ層、１３．１４・・・・・・箔。FIG. 1 is a sectional view showing the mounting state of a conventional flexible printed wiring board, and FIG. 2 is a sectional view of the flexible printed wiring board of the present invention.
FIGS. 3 and 4 are cross-sectional views showing the mounting state thereof. 10...Substrate, 11...Through hole, 12.
...Plating layer, 13.14 ...Foil.
Claims (1)
この孔内面にメッキ層を設けるとともに、基板の一方の
面に前記メッキ層と接続した独立のランドを設け、基板
の他方の面に前記メッキ層と接続した回路パターン箔を
設けたことを特徴とする可撓性印刷配線基板。 ／[Scope of claim for utility model registration] A through hole is provided in a flexible film-like substrate,
A plating layer is provided on the inner surface of the hole, an independent land connected to the plating layer is provided on one side of the board, and a circuit pattern foil connected to the plating layer is provided on the other side of the board. flexible printed wiring board. /
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10837581U JPS5812969U (en) | 1981-07-20 | 1981-07-20 | flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10837581U JPS5812969U (en) | 1981-07-20 | 1981-07-20 | flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5812969U true JPS5812969U (en) | 1983-01-27 |
Family
ID=29902783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10837581U Pending JPS5812969U (en) | 1981-07-20 | 1981-07-20 | flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812969U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201366U (en) * | 1985-06-04 | 1986-12-17 |
-
1981
- 1981-07-20 JP JP10837581U patent/JPS5812969U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201366U (en) * | 1985-06-04 | 1986-12-17 |
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