JPS6030567U - Printed wiring board for mounting chip components - Google Patents

Printed wiring board for mounting chip components

Info

Publication number
JPS6030567U
JPS6030567U JP12074483U JP12074483U JPS6030567U JP S6030567 U JPS6030567 U JP S6030567U JP 12074483 U JP12074483 U JP 12074483U JP 12074483 U JP12074483 U JP 12074483U JP S6030567 U JPS6030567 U JP S6030567U
Authority
JP
Japan
Prior art keywords
chip components
wiring board
printed wiring
mounting chip
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12074483U
Other languages
Japanese (ja)
Inventor
齋藤 泰元
弘 高野
杉浦 達夫
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP12074483U priority Critical patent/JPS6030567U/en
Publication of JPS6030567U publication Critical patent/JPS6030567U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のチップ部品の搭載状態を示す説明図、第
2図は本考案の実施例を示す平面図及び側断面図である
。 1・・・チップ部品、2・・・チップ部品用ランド、3
・・・接着剤、4・・・基板、5・・・平行隆条。
FIG. 1 is an explanatory diagram showing a state in which conventional chip components are mounted, and FIG. 2 is a plan view and a side sectional view showing an embodiment of the present invention. 1... Chip component, 2... Land for chip component, 3
...Adhesive, 4...Substrate, 5...Parallel ridges.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)基板上に設けたチップ部品搭載用ランド間に絶縁
性平行隆条を設けたことを特徴とするチップ部品搭載用
印刷配線板。
(1) A printed wiring board for mounting chip components, characterized in that parallel insulating ridges are provided between lands for mounting chip components provided on the substrate.
(2)絶縁性平行隆条がシルク印刷によるインク体であ
る実用新案登録請求の範囲第(1)項記載のチップ部品
搭載用印刷配線板。
(2) The printed wiring board for mounting chip components according to claim (1), wherein the insulating parallel ridges are ink bodies formed by silk printing.
JP12074483U 1983-08-04 1983-08-04 Printed wiring board for mounting chip components Pending JPS6030567U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12074483U JPS6030567U (en) 1983-08-04 1983-08-04 Printed wiring board for mounting chip components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12074483U JPS6030567U (en) 1983-08-04 1983-08-04 Printed wiring board for mounting chip components

Publications (1)

Publication Number Publication Date
JPS6030567U true JPS6030567U (en) 1985-03-01

Family

ID=30276609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12074483U Pending JPS6030567U (en) 1983-08-04 1983-08-04 Printed wiring board for mounting chip components

Country Status (1)

Country Link
JP (1) JPS6030567U (en)

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