JPS5858379U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5858379U
JPS5858379U JP15337381U JP15337381U JPS5858379U JP S5858379 U JPS5858379 U JP S5858379U JP 15337381 U JP15337381 U JP 15337381U JP 15337381 U JP15337381 U JP 15337381U JP S5858379 U JPS5858379 U JP S5858379U
Authority
JP
Japan
Prior art keywords
conductive pattern
printed board
area
pattern
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15337381U
Other languages
Japanese (ja)
Inventor
靖之 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP15337381U priority Critical patent/JPS5858379U/en
Publication of JPS5858379U publication Critical patent/JPS5858379U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来のプリント基板におけるチッ
プ部品の半田付は状態を説明するための側断面図および
平面図、第３図はこの考案になるプリント基板の実施例
を示す平面図である。 １・・・プリント基板、３．４・・・幅の狭い導電パタ
ーン、８・・・幅の広い導電パターン、９・・・半田メ
ッキ、１０・・・ソルダーレジスト、１１・・・細長い
導電　　　　　゛パターン。Figures 1 and 2 are a side sectional view and a plan view to explain the state of soldering of chip components on a conventional printed circuit board, and Figure 3 is a plan view showing an embodiment of the printed circuit board according to this invention. be. 1... Printed circuit board, 3.4... Narrow conductive pattern, 8... Wide conductive pattern, 9... Solder plating, 10... Solder resist, 11... Elongated conductive pattern. pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品などを取付けるための比較的幅（面積）の狭
い導電パターンと、アースパターンなどのような比較的
幅（面積）の広い導電パターンとを細長い導電パターン
で連接させて構成したことを特徴とするプリント基板。A conductive pattern with a relatively narrow width (area) for attaching chip parts, etc., and a conductive pattern with a relatively wide width (area), such as a ground pattern, are connected by an elongated conductive pattern. printed circuit board.
JP15337381U 1981-10-15 1981-10-15 Printed board Pending JPS5858379U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15337381U JPS5858379U (en) 1981-10-15 1981-10-15 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15337381U JPS5858379U (en) 1981-10-15 1981-10-15 Printed board

Publications (1)

Publication Number Publication Date
JPS5858379U true JPS5858379U (en) 1983-04-20

Family

ID=29945992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15337381U Pending JPS5858379U (en) 1981-10-15 1981-10-15 Printed board

Country Status (1)

Country Link
JP (1) JPS5858379U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305370A (en) * 2001-04-06 2002-10-18 Sanken Electric Co Ltd Circuit board, electronic component mounted body and method of manufacturing the same
JP2008072065A (en) * 2006-09-15 2008-03-27 Toyota Industries Corp Surface-mounting structure adapted for electronic component for surface-mounting

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526638A (en) * 1978-08-16 1980-02-26 Hitachi Ltd Water cooled type cooling device for transformer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526638A (en) * 1978-08-16 1980-02-26 Hitachi Ltd Water cooled type cooling device for transformer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305370A (en) * 2001-04-06 2002-10-18 Sanken Electric Co Ltd Circuit board, electronic component mounted body and method of manufacturing the same
JP2008072065A (en) * 2006-09-15 2008-03-27 Toyota Industries Corp Surface-mounting structure adapted for electronic component for surface-mounting

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