JPS58175668U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58175668U
JPS58175668U JP7405182U JP7405182U JPS58175668U JP S58175668 U JPS58175668 U JP S58175668U JP 7405182 U JP7405182 U JP 7405182U JP 7405182 U JP7405182 U JP 7405182U JP S58175668 U JPS58175668 U JP S58175668U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
copper foil
shaped
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7405182U
Other languages
Japanese (ja)
Inventor
大濱　泰造
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP7405182U priority Critical patent/JPS58175668U/en
Publication of JPS58175668U publication Critical patent/JPS58175668U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の印刷配線板を示し、ａは上面図、ｂは側
面図、第２図は本考案の一実施例の印刷配線板を示し、
ａは上面図、ｂは側面図である。 １．２・・・・・・銅箔、３・・・・・・チップ状回路
素子、４・・・・・・柱状の銅箔、５・・・・・・接着
剤、６・・・・・・基板、９・・・・・・枠状の銅箔。FIG. 1 shows a conventional printed wiring board, a is a top view, b is a side view, and FIG. 2 is a printed wiring board according to an embodiment of the present invention.
A is a top view, and b is a side view. 1.2... Copper foil, 3... Chip-shaped circuit element, 4... Column-shaped copper foil, 5... Adhesive, 6... ...Substrate, 9...Frame-shaped copper foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ状回路素子を基板上に接着する接着剤の広がりを
防止するための枠状の銅箔を設けたことを特徴とする印
刷配線板。　　−′A printed wiring board characterized in that a frame-shaped copper foil is provided to prevent spread of an adhesive for bonding a chip-shaped circuit element onto a substrate. −′
JP7405182U 1982-05-19 1982-05-19 printed wiring board Pending JPS58175668U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7405182U JPS58175668U (en) 1982-05-19 1982-05-19 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7405182U JPS58175668U (en) 1982-05-19 1982-05-19 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58175668U true JPS58175668U (en) 1983-11-24

Family

ID=30083515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7405182U Pending JPS58175668U (en) 1982-05-19 1982-05-19 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58175668U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11818840B2 (en) 2019-03-25 2023-11-14 Mitsubishi Electric Corporation Printed wiring board and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11818840B2 (en) 2019-03-25 2023-11-14 Mitsubishi Electric Corporation Printed wiring board and electronic device

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