JPS59192870U - printed circuit board equipment - Google Patents

printed circuit board equipment

Info

Publication number
JPS59192870U
JPS59192870U JP8875283U JP8875283U JPS59192870U JP S59192870 U JPS59192870 U JP S59192870U JP 8875283 U JP8875283 U JP 8875283U JP 8875283 U JP8875283 U JP 8875283U JP S59192870 U JPS59192870 U JP S59192870U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
board equipment
conductive foil
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8875283U
Other languages
Japanese (ja)
Inventor
西岡　一義
寺倉　豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8875283U priority Critical patent/JPS59192870U/en
Publication of JPS59192870U publication Critical patent/JPS59192870U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来におけるプリント基板の半田付工程を示す
図、第２図は本考案の一実施例におけるプリント基板装
置を示す側断面図である。 １１・・・・・・導電箔、１２・・・・・・ポスト・フ
ラックス、１３・・・・・・フッ素系界面活性剤、１４
・・・・・・プリント基板。FIG. 1 is a diagram showing a conventional soldering process for a printed circuit board, and FIG. 2 is a side sectional view showing a printed circuit board device according to an embodiment of the present invention. 11... Conductive foil, 12... Post flux, 13... Fluorine surfactant, 14
······Printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に導電箔を有し、他の面にフッ素系界面活性剤
の塗布層を設けてなるプリント基板装置。A printed circuit board device having a conductive foil on one side and a coating layer of a fluorine-based surfactant on the other side.
JP8875283U 1983-06-09 1983-06-09 printed circuit board equipment Pending JPS59192870U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8875283U JPS59192870U (en) 1983-06-09 1983-06-09 printed circuit board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8875283U JPS59192870U (en) 1983-06-09 1983-06-09 printed circuit board equipment

Publications (1)

Publication Number Publication Date
JPS59192870U true JPS59192870U (en) 1984-12-21

Family

ID=30218660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8875283U Pending JPS59192870U (en) 1983-06-09 1983-06-09 printed circuit board equipment

Country Status (1)

Country Link
JP (1) JPS59192870U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226994A (en) * 1987-03-16 1988-09-21 日本シイエムケイ株式会社 Printing ink for solder resist of printed wiring board and the like

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554991A (en) * 1978-06-26 1980-01-14 Ibm Method of forming protected coating of electronic circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554991A (en) * 1978-06-26 1980-01-14 Ibm Method of forming protected coating of electronic circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226994A (en) * 1987-03-16 1988-09-21 日本シイエムケイ株式会社 Printing ink for solder resist of printed wiring board and the like

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