JPS6081674U - Ceramic hybrid integrated circuit device - Google Patents

Ceramic hybrid integrated circuit device

Info

Publication number
JPS6081674U
JPS6081674U JP17491383U JP17491383U JPS6081674U JP S6081674 U JPS6081674 U JP S6081674U JP 17491383 U JP17491383 U JP 17491383U JP 17491383 U JP17491383 U JP 17491383U JP S6081674 U JPS6081674 U JP S6081674U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
ceramic hybrid
circuit device
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17491383U
Other languages
Japanese (ja)
Inventor
海辺　進
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP17491383U priority Critical patent/JPS6081674U/en
Publication of JPS6081674U publication Critical patent/JPS6081674U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のセラミック混成集積回路装置−の一実
施例を示す平面図、第２図はその断面図、第３図、第４
図および第５図は同装置に使用されるリードの作成過程
を説明するための平面図である。 １・・・・・・セラミック混成集積回路素子、２・・・
・・・リード。Fig. 1 is a plan view showing an embodiment of the ceramic hybrid integrated circuit device of the present invention, Fig. 2 is a sectional view thereof, Figs.
This figure and FIG. 5 are plan views for explaining the process of creating a lead used in the device. 1...Ceramic hybrid integrated circuit element, 2...
...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多端子を有するセラミック混成集積回路素子をフレキシ
ブル印刷配線板上に接着し、セラミック、　　混成集積
回路素子の端子と上記フレキシブル印刷配線板上に設け
た一方の多端子をハンダ付けによって固定化し、上記フ
レキシブル印刷配線板上の他方の多端子を実装基板にハ
ンダ付けによって取り付けられるように構成したセラミ
ック混成集積回路装置。A ceramic hybrid integrated circuit element having multiple terminals is bonded onto a flexible printed wiring board, and the terminals of the ceramic hybrid integrated circuit element and one of the multiterminals provided on the flexible printed wiring board are fixed by soldering. A ceramic hybrid integrated circuit device configured such that the other multi-terminal on the printed wiring board can be attached to a mounting board by soldering.
JP17491383U 1983-11-11 1983-11-11 Ceramic hybrid integrated circuit device Pending JPS6081674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17491383U JPS6081674U (en) 1983-11-11 1983-11-11 Ceramic hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17491383U JPS6081674U (en) 1983-11-11 1983-11-11 Ceramic hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6081674U true JPS6081674U (en) 1985-06-06

Family

ID=30380672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17491383U Pending JPS6081674U (en) 1983-11-11 1983-11-11 Ceramic hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6081674U (en)

Similar Documents

Publication Publication Date Title
JPS6081674U (en) Ceramic hybrid integrated circuit device
JPS5939971U (en) Printed board
JPS58175668U (en) printed wiring board
JPS5844871U (en) wiring board
JPS5965563U (en) printed wiring board
JPS58182343U (en) printed circuit board equipment
JPS606242U (en) hybrid integrated circuit
JPS5878678U (en) printed circuit board equipment
JPS6130271U (en) Printed board
JPS6090873U (en) Hybrid integrated circuit device
JPS5999477U (en) Hybrid integrated circuit device
JPS59159975U (en) hybrid integrated circuit board
JPS6039277U (en) Wiring board equipment
JPS59143093U (en) Electronic component mounting board
JPS5858327U (en) chip parts
JPS58138370U (en) LSI package spacer
JPS59176175U (en) printed circuit board
JPS583061U (en) Parts mounting structure
JPS58193666U (en) Flexible printed wiring device
JPS5874346U (en) integrated circuit module
JPS5837168U (en) Electrical component mounting unit
JPS5829868U (en) integrated circuit mounting structure
JPS58196869U (en) Electrical component mounting structure on printed wiring board
JPS6073277U (en) hybrid integrated circuit board
JPS6133410U (en) printed coil