JPS6039277U - Wiring board equipment - Google Patents

Wiring board equipment

Info

Publication number
JPS6039277U
JPS6039277U JP13290483U JP13290483U JPS6039277U JP S6039277 U JPS6039277 U JP S6039277U JP 13290483 U JP13290483 U JP 13290483U JP 13290483 U JP13290483 U JP 13290483U JP S6039277 U JPS6039277 U JP S6039277U
Authority
JP
Japan
Prior art keywords
wiring board
board equipment
motherboard
lead terminals
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13290483U
Other languages
Japanese (ja)
Inventor
後藤 基之
徳田 龍馬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13290483U priority Critical patent/JPS6039277U/en
Publication of JPS6039277U publication Critical patent/JPS6039277U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1、第2図は従来例の一部切欠側面図、第3図はこの
考案の一実施例を示す一部切欠側面図、第4図は第3図
の平面図である。 1・・・モジュール基板、3・・・リード端子、4・・
・マザーボード。なお、図中同一符号は同一または相当
部分を示す。
1 and 2 are a partially cutaway side view of a conventional example, FIG. 3 is a partially cutaway side view showing an embodiment of the invention, and FIG. 4 is a plan view of FIG. 3. 1...Module board, 3...Lead terminal, 4...
・Motherboard. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マザーボードと、その上部に位置するモジュール基板と
の間をリード端子により接続する構成で、上記リード端
子を上記マザーボードに対し、このマザーボードの表面
に半田付は接続したことを特徴とする配線基板装置。
A wiring board device characterized in that a motherboard and a module board located above the motherboard are connected by lead terminals, and the lead terminals are connected to the motherboard by soldering to the surface of the motherboard.
JP13290483U 1983-08-25 1983-08-25 Wiring board equipment Pending JPS6039277U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13290483U JPS6039277U (en) 1983-08-25 1983-08-25 Wiring board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13290483U JPS6039277U (en) 1983-08-25 1983-08-25 Wiring board equipment

Publications (1)

Publication Number Publication Date
JPS6039277U true JPS6039277U (en) 1985-03-19

Family

ID=30299981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13290483U Pending JPS6039277U (en) 1983-08-25 1983-08-25 Wiring board equipment

Country Status (1)

Country Link
JP (1) JPS6039277U (en)

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