JPS59143093U - Electronic component mounting board - Google Patents

Electronic component mounting board

Info

Publication number
JPS59143093U
JPS59143093U JP3858383U JP3858383U JPS59143093U JP S59143093 U JPS59143093 U JP S59143093U JP 3858383 U JP3858383 U JP 3858383U JP 3858383 U JP3858383 U JP 3858383U JP S59143093 U JPS59143093 U JP S59143093U
Authority
JP
Japan
Prior art keywords
component mounting
electronic component
mounting board
wiring
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3858383U
Other languages
Japanese (ja)
Inventor
俊雄 岩田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP3858383U priority Critical patent/JPS59143093U/en
Publication of JPS59143093U publication Critical patent/JPS59143093U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は従来の電子部品塔載基板の構成図で、
イは側面図、口はその平面図、第３図はこの考案の一実
施例の構成図であり、イは側面図、口はその平面図であ
る。 図中、２１．２２は配線基板、２３．２４．　−２５．
２６は電子部品、２７は絶縁基板である。Figures 1 and 2 are configuration diagrams of conventional electronic component mounting boards.
A is a side view, the mouth is a plan view thereof, and FIG. 3 is a configuration diagram of an embodiment of this invention, A is a side view, and the mouth is a plan view thereof. In the figure, 21.22 is a wiring board, 23.24. -25.
26 is an electronic component, and 27 is an insulating substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気配線を備えた配線基板に、電子部品を搭載してなる
電子部品搭載基板において、電子部品を片面に塔載した
配線基板２枚を、電気的絶縁材を挾んで、それぞれ電子
部品搭載面とは反対の面において接合したことを特徴と
する電子部品塔載基板。In an electronic component mounting board in which electronic components are mounted on a wiring board equipped with electrical wiring, two wiring boards with electronic components mounted on one side are placed on the electronic component mounting surface and the other with an electrical insulating material in between. 1. An electronic component mounting board characterized by bonding on opposite sides.
JP3858383U 1983-03-15 1983-03-15 Electronic component mounting board Pending JPS59143093U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3858383U JPS59143093U (en) 1983-03-15 1983-03-15 Electronic component mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3858383U JPS59143093U (en) 1983-03-15 1983-03-15 Electronic component mounting board

Publications (1)

Publication Number Publication Date
JPS59143093U true JPS59143093U (en) 1984-09-25

Family

ID=30169249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3858383U Pending JPS59143093U (en) 1983-03-15 1983-03-15 Electronic component mounting board

Country Status (1)

Country Link
JP (1) JPS59143093U (en)

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