JPS5999477U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS5999477U
JPS5999477U JP20169582U JP20169582U JPS5999477U JP S5999477 U JPS5999477 U JP S5999477U JP 20169582 U JP20169582 U JP 20169582U JP 20169582 U JP20169582 U JP 20169582U JP S5999477 U JPS5999477 U JP S5999477U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
abstract
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20169582U
Other languages
Japanese (ja)
Inventor
森　整
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP20169582U priority Critical patent/JPS5999477U/en
Publication of JPS5999477U publication Critical patent/JPS5999477U/en
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来装置の概略断面図、第２図は従来装置の改
良型における要部模式断面図、第３図はこの考案に係る
一実施例の混成集積回路装置の概略断面図である。 １　ｌｂ、　　１　ｌｂ−・・プリント配線基板、１２
ａ。 １２ｂ・・・配線パターン、１３・・・電子部品。FIG. 1 is a schematic cross-sectional view of a conventional device, FIG. 2 is a schematic cross-sectional view of essential parts of an improved version of the conventional device, and FIG. 3 is a schematic cross-sectional view of an embodiment of a hybrid integrated circuit device according to this invention. 1 lb, 1 lb--Printed wiring board, 12
a. 12b... Wiring pattern, 13... Electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 相互に配線パターン面を対向して配置した一組のプリン
ト配線基板間に１、リードレスとしたメルフ型もしくは
チップ型等の電子部品が挾み込まれてなる混成集積回路
装置。A hybrid integrated circuit device comprising a leadless Melf type or chip type electronic component sandwiched between a pair of printed wiring boards arranged with their wiring pattern surfaces facing each other.
JP20169582U 1982-12-23 1982-12-23 Hybrid integrated circuit device Pending JPS5999477U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20169582U JPS5999477U (en) 1982-12-23 1982-12-23 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20169582U JPS5999477U (en) 1982-12-23 1982-12-23 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5999477U true JPS5999477U (en) 1984-07-05

Family

ID=30427185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20169582U Pending JPS5999477U (en) 1982-12-23 1982-12-23 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5999477U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175727A (en) * 2012-02-23 2013-09-05 Semikron Elektronik Gmbh & Co Kg Semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175727A (en) * 2012-02-23 2013-09-05 Semikron Elektronik Gmbh & Co Kg Semiconductor module

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